Title:
THERMAL CONDUCTIVE FILLER AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/035383
Kind Code:
A1
Abstract:
A method to prepare a thermal conductive filler, particularly a thermal conductive filler for preparation of a thermal conductive material with reduced viscosity, comprising the step of dry mixing a platelet boron nitride with a fumed silica or a fumed metal oxide with a primary particle size of 1-200 nm. A thermal conductive filler, a thermal conductive material and an electronic device are also provided.
Inventors:
HU SHUANGQUAN (CN)
HUANG YUAN-CHANG (CN)
HUANG YUAN-CHANG (CN)
Application Number:
PCT/CN2019/102166
Publication Date:
March 04, 2021
Filing Date:
August 23, 2019
Export Citation:
Assignee:
EVONIK SPECIALTY CHEMICALS SHANGHAI CO LTD (CN)
EVONIK TAIWAN LTD (CN)
EVONIK TAIWAN LTD (CN)
International Classes:
C08K3/38; B32B15/00; B32B15/04; B32B27/00; B32B33/00; C01B21/04; C08K3/36; C08K9/02; C08L63/00; C09K5/14
Domestic Patent References:
| WO2010141432A1 | 2010-12-09 |
Foreign References:
| CN109988409A | 2019-07-09 | |||
| US20070054122A1 | 2007-03-08 | |||
| US20030038278A1 | 2003-02-27 | |||
| US9850365B1 | 2017-12-26 |
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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