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Title:
THERMAL-CONDUCTIVE SHEET, LED MOUNTING SUBSTRATE, AND LED MODULE
Document Type and Number:
WIPO Patent Application WO/2013/057889
Kind Code:
A1
Abstract:
The present invention provides a thermal-conductive sheet having excellent heat dissipation characteristics, in which a thermal-conductive filler is dispersed in a polymer matrix. The present invention is a thermal-conductive sheet in which a non-spherical thermal-conductive filler is dispersed in a polymer matrix, wherein at least a portion of the thermal-conductive filler is oriented in the thickness direction of the sheet, and when the portion of the thermal-conductive filler that has the highest degree of orientation in the thickness direction of the sheet is the orientation center, and an axis passing through the orientation center and perpendicular to the sheet surface is the central axis of orientation, the thermal-conductive sheet has a portion in which the thermal-conductive filler is oriented toward one point on the central axis of orientation, and the degree of orientation of the thermal-conductive filler in the thickness direction of the sheet decreases progressively toward the peripheral edge of the sheet from the center of orientation.

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Inventors:
TAKAYAMA YOSHINARI (JP)
HIDA TAKAFUMI (JP)
KITAGAWA DAISUKE (JP)
TAGAWA KENICHI (JP)
NAGASAKI KUNIO (JP)
MATSUSHIMA RYOICHI (JP)
KIYOHARA SUSUMU (JP)
UOTA TOSHIO (JP)
Application Number:
PCT/JP2012/006326
Publication Date:
April 25, 2013
Filing Date:
October 03, 2012
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J5/18; C08F2/00; C08J7/00; C08K3/28; C08K7/06; C08L27/12; C08L33/06; C08L101/00; C09K5/00; H01L23/36; H01L33/64
Foreign References:
JP2005347616A2005-12-15
JP2005297456A2005-10-27
JP2011174016A2011-09-08
JP2011032430A2011-02-17
JP2011000824A2011-01-06
JP2010254766A2010-11-11
JP2001214075A2001-08-07
JP2000281995A2000-10-10
JP2007012911A2007-01-18
JP2007012912A2007-01-18
JP2007012913A2007-01-18
Other References:
See also references of EP 2770014A4
Attorney, Agent or Firm:
KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)
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Claims:



 
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