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Patent Searching and Data


Title:
THERMAL CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/105601
Kind Code:
A1
Abstract:
This thermal conductive sheet (10) comprises a plurality of unit layers (13) each including a silicone resin (11), wherein the plurality of unit layers (13) are laminated to be bonded to each other. At least one of the plurality of unit layers (13) contains a thermal conductive filler, and when compressed at 0.276 MPa, has a compression ratio of 20% to 65%.

Inventors:
KUDOH HIROKI (JP)
Application Number:
JP2019/045144
Publication Date:
May 28, 2020
Filing Date:
November 18, 2019
Export Citation:
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Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
B32B27/00; B29C70/88; B32B27/20; H01L23/36; H05K7/20
Domestic Patent References:
WO2017179318A12017-10-19
WO2009008308A12009-01-15
Foreign References:
JP2019064192A2019-04-25
JP2019123174A2019-07-25
JP2014027144A2014-02-06
CN106810877A2017-06-09
JP2014031501A2014-02-20
JP2010003981A2010-01-07
JP2009295921A2009-12-17
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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