THERMAL CONDUCTIVE UNIT AND COOLING DEVICE

WIPO Patent Application WO/2022/071483

A1

In the present invention, a thermal conductive member of a thermal conductive unit has a main body region and a peripheral region. A support member of the thermal conductive unit has a first support part which supports part of the peripheral region and a second support part which supports another part of the peripheral region. The width of the first support part differs from the width of the second support part. The thermal conductive member has a first plate and a second plate which are positioned so as to overlap in the thickness direction. At least one of the first plate and the second plate has a depression which has therein an accommodation space for a working medium. The first plate has a first joining part. The second plate has a second joining part. The peripheral region has a joining region of the first joining part and second joining part, and a closing region which has a closing part for the accommodation space. The closing part is positioned on a supported region of the peripheral region which is supported by whichever of the first support part and second support part has greater width.

TAKAO MASASHI (TW)
YANG SHIH YU (TW)
KOSEKI TOSHIHIKO (JP)
HANANO MASAAKI (JP)

PCT/JP2021/036103

April 07, 2022

September 30, 2021

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NIDEC CORP (JP)
NIDEC CHAUN CHOUNG TECH CORP (TW)

F28D15/02

WO2019026786A1	2019-02-07
WO2020026908A1	2020-02-06
WO2020188896A1	2020-09-24
WO2021153443A1	2021-08-05

US20190249928A1	2019-08-15
JP2016017702A	2016-02-01
JP2003254685A	2003-09-10
US20070107874A1	2007-05-17
JP2018162949A	2018-10-18
JPH09210582A	1997-08-12
US20090178784A1	2009-07-16

ARAKAWA Satoshi et al. (JP)

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