Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL CONDUCTIVITY MEASUREMENT DEVICE AND THERMAL CONDUCTIVITY MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/131482
Kind Code:
A1
Abstract:
This thermal conductivity measurement device comprises: a second clamping member which together with a first clamping member, clamps an object to be measured; a heating member which heats the first clamping member and has a contacting end surface which contacts a distal end surface of the first clamping member through a first axial correction member having two facing surfaces, and a distal end surface on the reverse side of the contacting end surface; a cooling member which cools the second clamping member and has a contacting end surface which contacts a distal end surface of the second clamping member through a second axial correction member having two facing surfaces, and a distal end surface on the reverse side of the contacting end surface; a plurality of temperature sensors disposed on the first clamping member and the second clamping member; and a pressing force applying mechanism which applies a pressing force between the heating member and the cooling member. At least one surface of the first axial correction member and the second axial correction member is a curved surface having a convex curved shape, and the other surface is a flat surface.

Inventors:
TADA HARUNA (JP)
SANDA YASUYUKI (JP)
NAKAJIMA DAI (JP)
Application Number:
PCT/JP2017/046879
Publication Date:
July 19, 2018
Filing Date:
December 27, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01N25/18
Domestic Patent References:
WO2017073479A12017-05-04
Foreign References:
JP2012032196A2012-02-16
US6142662A2000-11-07
JPS49106879A1974-10-09
Other References:
CULHAM, J. R. ET AL.: "DESIGN, ASSEMBLY AND COMMISSIONING OF A TEST APPARATUS FOR CHARACTERIZING THERMAL INTERFACE MATERIALS", INTER SOCIEY CONFERENCE ON THERMAL PHENOMENA IN ELECTRONIC SYSTEMS, 2002, pages 128 - 135, XP055513401
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Download PDF:



 
Previous Patent: MATTE MATERIAL FOR FIELD CONTAINER BAG

Next Patent: WIRE HARNESS