THERMAL CONDUCTIVITY MEASUREMENT METHOD

WIPO Patent Application WO/2013/058134

A1

Provided is a thermal conductivity measurement method with which measurement precision is improved. A thermal conductivity measurement method according to the present invention is a method of: positioning a test body (10) between a heating plate (30) and a cooling heat plate (30) such that the outer circumference face (11) of the test body (10) is further inward than the outer circumference face (31) of the heating plate (30) and the outer circumference face (41) of the cooling heat plate (40); covering the outer circumference face (11) of the test body (10) between the heating plate (30) and the cooling heat plate (40) with an insulation material (20); and measuring the thermal conductivity of the test body (10) with a thermal flow measuring technique.

WO/2009/034787	THIN FILM THERMOPHYSICAL PROPERTY MEASURING METHOD AND THIN FILM THERMOPHYSICAL PROPERTY MEASURING APPARATUS
JP5490628	Method of measuring heat constant using light heating method
WO/2003/054534	FLUID MIXTURE COMPOSITION SENSOR

OHMURA TAKAHIRO (JP)

PCT/JP2012/076052

April 25, 2013

October 05, 2012

Click for automatic bibliography generation  

NICHIAS CORP (JP)

G01N25/18

JP2003270180A	2003-09-25
JPH01184448A	1989-07-24
JP2000329718A	2000-11-30
JPS5937454A	1984-02-29
JPS5484780A	1979-07-05
JP2002116167A	2002-04-19
JP2004003872A	2004-01-08

TAKAHIRO OMURA: "Measurement of thermal conductivity for thermal insulation", JOURNAL OF THE HEAT TRANSFER SOCIETY OF JAPAN, vol. 48, no. 205, October 2009 (2009-10-01), pages 20 - 25
TAKAHIRO OMURA: "Measurement of Thermal Conductivities of Thermal Insulations", JAPAN JOURNAL OF THERMOPHYSICAL PROPERTIES, vol. 23, no. 2, 31 May 2009 (2009-05-31), pages 117 - 121

HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
Patent business corporation far international patent firm (JP)

View/Download PDF      PDF Help

Previous Patent: TRANSMISSION DEVICE, TRANSMISSION METHOD AND RECEPTION DEVICE

Next Patent: FUEL CELL MODULE