Title:
THERMAL DECOUPLING OF THE FIXATION OF A HIGH TEMPERATURE SENSOR IN A RECEIVING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2014/041169
Kind Code:
A3
Abstract:
The invention relates to a high temperature sensor comprising a sensor element provided with a measuring section oriented towards the hot side, and a securing device arranged about the sensor element, said securing device comprising a securing element for securing the high temperature sensor in a receiving element, in particular a screw or a nut, and a securing strip which is arranged relative to the securing element on the hot side of the high temperature sensor and which is thermally decoupled from the securing element.
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Inventors:
LANTZSCH HEIKO (DE)
Application Number:
PCT/EP2013/069157
Publication Date:
July 31, 2014
Filing Date:
September 16, 2013
Export Citation:
Assignee:
TESONA GMBH & CO KG (DE)
International Classes:
G01K1/14; G01K1/08
Foreign References:
| US5753835A | 1998-05-19 | |||
| DE4344174A1 | 1995-07-06 | |||
| US20050038172A1 | 2005-02-17 | |||
| EP2354770A1 | 2011-08-10 | |||
| DE102004010912A1 | 2005-09-22 |
Attorney, Agent or Firm:
MEISSNER BOLTE (München, DE)
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