Title:
THERMAL DETECTION ELEMENT, METHOD FOR MANUFACTURING THERMAL DETECTION ELEMENT, AND IMAGE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/238277
Kind Code:
A1
Abstract:
A thermal detection element according to one embodiment of the present invention comprises a substrate and a plurality of heat detection units. Each of the plurality of heat detection units is disposed on the substrate. Each of the plurality of heat detection units has a first electrode, a second electrode that is disposed on the substrate, a thermoelectric conversion unit that is disposed between the first and second electrodes, and an absorption part that is disposed on the first electrode and that absorbs infrared rays and generates heat. The absorption part of each of the plurality of heat detection units is configured to be set apart from the absorption parts of the other heat detection units.
Inventors:
ANO TAISHI (JP)
KADONO KOJI (JP)
IMAIZUMI SHINJI (JP)
KADONO KOJI (JP)
IMAIZUMI SHINJI (JP)
Application Number:
PCT/JP2022/023108
Publication Date:
December 14, 2023
Filing Date:
June 08, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
G01J1/02
Domestic Patent References:
| WO2011145295A1 | 2011-11-24 |
Foreign References:
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Attorney, Agent or Firm:
MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)
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