Title:
THERMAL DIFFUSION MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/210067
Kind Code:
A1
Abstract:
The present invention provides a thermal diffusion member with which it is possible to suppress the generation of a local high-temperature section in a casing surface of an electronic device in which a heat-generating element is incorporated, and that moreover can reduce the temperature of the heat-generating element by 2°C or more. This thermal diffusion member is a laminate in which a plurality of layers, including a low-thermal-conductivity layer and a high-thermal-conductivity layer, are laminated. The low-thermal-conductivity layer is configured from a low-thermal-conductivity-material sheet having a thermal conductivity of 0.13-0.34 W/m⋅K and a specific heat of 0.9-1.67 J/g⋅K. The high-thermal-conductivity layer is configured from a graphite sheet having a thermal conductivity of 1500 W/m⋅K or higher in a planar direction within the high-thermal-conductivity layer.
Inventors:
YAMADA KAZUKI (JP)
KAWAI TAKETO (JP)
DONG SHUCHEN (JP)
KAWAI TAKETO (JP)
DONG SHUCHEN (JP)
Application Number:
PCT/JP2023/000613
Publication Date:
November 02, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
KITAGAWA IND CO LTD (JP)
International Classes:
H01L23/36; B32B7/027; H05K7/20
Foreign References:
| JP2009111003A | 2009-05-21 | |||
| JP2018164094A | 2018-10-18 |
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL IP FIRM (JP)
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