Title:
THERMAL DISSIPATING PRINTED CIRCUIT BOARD AND METHODS
Document Type and Number:
WIPO Patent Application WO2003096775
Kind Code:
A3
Abstract:
A multilayer circuit board (100) comprising at least one substantially void free encapsulated heavy copper core (110) and methods for producing such a board. Such a board may be formed by providing a first core (110) that includes a substrate (130) and heavy copper circuit traces (111A), filling the spaces between circuit traces with a resin (111B), and at least partially curing the resin so as to form two exposed and substantially planar surfaces on opposite sides of the core. The filled and planarized core is then laminated with additional dielectric layers to form a fully cured, void free multilayer printed circuit board (100).
Inventors:
GOTRO JEFF (US)
FERNANDES KARIM (US)
FERNANDES KARIM (US)
Application Number:
PCT/US2003/014091
Publication Date:
July 28, 2005
Filing Date:
May 06, 2003
Export Citation:
Assignee:
FUTURE TECHNOLOGY (US)
GOTRO JEFF (US)
FERNANDES KARIM (US)
GOTRO JEFF (US)
FERNANDES KARIM (US)
International Classes:
H05K3/46; (IPC1-7): H05K1/00
Foreign References:
| US6455784B1 | 2002-09-24 | |||
| US6565954B2 | 2003-05-20 | |||
| US6518514B2 | 2003-02-11 |
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