Title:
THERMAL FLOWRATE SENSOR AND FLUID CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/264574
Kind Code:
A1
Abstract:
To reduce the amount of external thermal influence on a measured flow rate while achieving quick stabilization of the temperature distribution of a fluid, and improving response speed, the present invention comprises: a pair of electrical resistive wires 13A, 13B wound on a pipe 20 through which a fluid flows; a heat dissipation part 61 which dissipates the heat from the electrical resistive wires 13A, 13B to the outside; and a low-heat-transfer member 70 which is provided around the heat dissipation part 61 and has a lower heat conductivity than the heat dissipation part 61.
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Inventors:
OKANO HIROYUKI (JP)
Application Number:
PCT/JP2022/011795
Publication Date:
December 22, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
HORIBA STEC CO LTD (JP)
International Classes:
G01F1/684
Domestic Patent References:
| WO2018180387A1 | 2018-10-04 |
Foreign References:
| JPH06507713A | 1994-09-01 | |||
| JPS63133020A | 1988-06-04 | |||
| JPS59105520A | 1984-06-18 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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