Title:
THERMAL FLUID FLOW-RATE SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/111096
Kind Code:
A1
Abstract:
In a case where in a thermal fluid flow-rate sensor having a detection unit and circuit unit formed on the same substrate, stress is adjusted through the formation of a deep recess part on an interlayer insulating film and the formation thereabove of an insulating film having tensile strength, the present invention prevents the reliability of the thermal fluid flow-rate sensor from degrading as a result of cracking, and the like, in the insulating film. As a means of doing so, on a diaphragm part, a stair-like step is provided on a side wall of the recess part formed in the interlayer insulating film. As a result, the depths of a first recess part and second recess part composing the recess part are reduced, and the coverage of the insulating film for stress adjustment that covers the side walls and lower surface of the recess part is enhanced.
Inventors:
SAKUMA NORIYUKI (JP)
ONOSE YASUO (JP)
TASHIRO SHINOBU (JP)
DOI RYOSUKE (JP)
ONOSE YASUO (JP)
TASHIRO SHINOBU (JP)
DOI RYOSUKE (JP)
Application Number:
PCT/JP2015/083201
Publication Date:
July 14, 2016
Filing Date:
November 26, 2015
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01F1/692; B81B1/00
Foreign References:
| US20070231942A1 | 2007-10-04 | |||
| EP2348292A1 | 2011-07-27 | |||
| JP2012202786A | 2012-10-22 | |||
| JP2015224993A | 2015-12-14 |
Other References:
See also references of EP 3244173A4
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
Patent business corporation Tsutsui international patent firm (JP)
Patent business corporation Tsutsui international patent firm (JP)
Download PDF: