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Patent Searching and Data


Title:
THERMAL HEAD
Document Type and Number:
WIPO Patent Application WO/2019/064826
Kind Code:
A1
Abstract:
A thermal head is provided with: an underglaze layer provided on an insulating substrate; an electrode provided on the underglaze layer; a heating element provided on the electrode; a first protection layer coating at least the heating element and containing glass material; and a second protection layer provided on the first protection layer, having a melting point higher than that of the first protection layer, and made of material having a thermal expansion coefficient which is substantially constant with respect to temperature at 1000°C or lower.

Inventors:
MIYASHIGE MICHIHIRO (JP)
ONISHI NORIAKI (JP)
YAMAJI NORIO (JP)
Application Number:
PCT/JP2018/026365
Publication Date:
April 04, 2019
Filing Date:
July 12, 2018
Export Citation:
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Assignee:
AOI ELECTRONICS CO LTD (JP)
International Classes:
B41J2/335
Foreign References:
JPH04214367A1992-08-05
JPH068501A1994-01-18
JP2005119094A2005-05-12
JP2008207439A2008-09-11
JPH05309855A1993-11-22
JP2000153630A2000-06-06
JPH06155793A1994-06-03
US6081287A2000-06-27
Attorney, Agent or Firm:
NAGAI, Fuyuki et al. (JP)
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