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Patent Searching and Data


Title:
THERMAL INSULATION BODY
Document Type and Number:
WIPO Patent Application WO/2019/176514
Kind Code:
A1
Abstract:
Provided is a thermal insulation body which is easy to produce and is capable of preventing the occurrence of heat bridges. This thermal insulation body is provided with a first thermal insulation block (A1), a second plate (21) and a second thermal insulation block (A2). The first thermal insulation block (A1) comprises: a first plate (22); a vacuum thermal insulation material (60) which is arranged at a distance from the first plate (22) in a predetermined direction; and a bonding material (70) for bonding the first plate (22) and the vacuum thermal insulation material (60) with each other. The second plate (21) is arranged at a distance from the first thermal insulation block (A1) in the above-mentioned predetermined direction. The second thermal insulation block (A2) is provided so as to fill up the space between the first thermal insulation block (A1) and the second plate (21).

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Inventors:
YOSHINO, Dai
MIZUMOTO, Kenichi
TANABE, Shota
Application Number:
JP2019/007006
Publication Date:
September 19, 2019
Filing Date:
February 25, 2019
Export Citation:
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Assignee:
PHC HOLDINGS CORPORATION (2-38-5, Nishishimbashi Minato-k, Tokyo 33, 〒1058433, JP)
International Classes:
F25D23/06; F16L59/02; F16L59/065; F25D17/04; F25D19/00
Foreign References:
JPS60155884U1985-10-17
JP2005282628A2005-10-13
JPH0120631Y21989-06-21
JPH0468989U1992-06-18
JP2007178080A2007-07-12
JP2010048427A2010-03-04
JP2004011997A2004-01-15
JPH0360039B21991-09-12
JP2005282973A2005-10-13
JPH0654192B21994-07-20
Attorney, Agent or Firm:
WASHIDA, Kimihito (8th Floor, Shinjuku First West Bldg. 1-23-7, Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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