Title:
THERMAL INSULATION FILLER, THERMAL INSULATION MATERIAL AND THERMAL INSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/009226
Kind Code:
A1
Abstract:
A thermal insulation filler which contains a mixed silica powder that is composed of from 10% by mass to 80% by mass of dry silica and from 20% by mass to 90% by mass of wet silica having a moisture content of 2% by mass or more. It is preferable that from 1 part by mass to 10 parts by mass of inorganic fibers are contained per 100 parts by mass of the mixed silica powder; and it is also preferable that the inorganic fibers have an average fiber diameter of from 0.1 μm to 50 μm.
Inventors:
MIZUTA KOHEI (JP)
NAGASAKI HIRONORI (JP)
TABARA KAZUTO (JP)
NAITO MAKIO (JP)
NAGASAKI HIRONORI (JP)
TABARA KAZUTO (JP)
NAITO MAKIO (JP)
Application Number:
PCT/JP2019/026834
Publication Date:
January 09, 2020
Filing Date:
July 05, 2019
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
C04B30/02; C01B33/18; D06M11/79; F16L59/00
Foreign References:
| JP2013199421A | 2013-10-03 | |||
| JP2003026759A | 2003-01-29 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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