Title:
THERMAL INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/181443
Kind Code:
A1
Abstract:
This thermal insulation material is provided with a thermal insulation layer which has: a porous structure for forming a skeleton where a plurality of particles are connected while having pores inside and having a hydrophobic site on the surface thereof or on the surface and on the inside; infrared ray-shielding particles; and inorganic fibers. Said thermal insulation layer satisfies the following conditions (a)-(d). The content of the components in conditions (a)-(d) are calculated based on the mass of the thermal insulation layer overall being 100 mass%. (a) The content of said inorganic fibers is 5-25 mass%, inclusive. (b) The content of said infrared ray-shielding particles is 10 mass% or higher. (c) The content obtained by combining the porous structure and the infrared ray-shielding particles is 70 mass% or higher. (d) The ratio of the content of the porous structure to the content of the infrared ray-shielding particles is 1.2 or higher.
Inventors:
TAGUCHI YUTARO (JP)
KANDA SHIGEKI (JP)
KANDA SHIGEKI (JP)
Application Number:
PCT/JP2022/029291
Publication Date:
September 28, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
SUMITOMO RIKO CO LTD (JP)
International Classes:
F16L59/04; C04B38/00; F16L59/08
Domestic Patent References:
| WO2013141189A1 | 2013-09-26 | |||
| WO2021095279A1 | 2021-05-20 | |||
| WO2016163670A1 | 2016-10-13 | |||
| WO2021095279A1 | 2021-05-20 | |||
| WO2013141189A1 | 2013-09-26 |
Foreign References:
| JPH07237957A | 1995-09-12 | |||
| JPS57187512A | 1982-11-18 | |||
| JP2011088125A | 2011-05-06 | |||
| JPH0733551A | 1995-02-03 | |||
| JP2015529272A | 2015-10-05 | |||
| JP2010176947A | 2010-08-12 | |||
| JP2009299893A | 2009-12-24 | |||
| JP2021143733A | 2021-09-24 | |||
| CN206943696U | 2018-01-30 | |||
| JP2009299893A | 2009-12-24 | |||
| JP2020016326A | 2020-01-30 |
Attorney, Agent or Firm:
HIGASHIGUCHI Michiaki et al. (JP)
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