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Title:
THERMAL INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/038843
Kind Code:
A1
Abstract:
Provided is a thermal insulation material including a thermal insulation layer. The thermal insulation layer contains silicon dioxide particles, inorganic fibers, and at least one non-polymer dispersant represented by formula (A1), (A2), (A3), or (A4). The BET specific surface area of the silicon dioxide particles is 90 m2/g or more and less than 380 m2/g.

Inventors:
KAWAKAMI MAHO (JP)
TSUJITA KAKERU (JP)
Application Number:
PCT/JP2023/029429
Publication Date:
February 22, 2024
Filing Date:
August 14, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
F16L59/02; C07C211/03; C07C211/63; H01M10/651; H01M10/658
Domestic Patent References:
WO2023058689A12023-04-13
Foreign References:
JP2020066830A2020-04-30
JP2020012230A2020-01-23
JP2017057511A2017-03-23
Attorney, Agent or Firm:
OI, Michiko (JP)
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