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Patent Searching and Data


Title:
THERMAL MANAGEMENT SYSTEMS FOR WEARABLE COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/093917
Kind Code:
A8
Abstract:
In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.

Inventors:
WOODS MICHAEL JANUSZ (US)
GRECO PAUL M (US)
Application Number:
PCT/US2017/061823
Publication Date:
June 06, 2019
Filing Date:
November 15, 2017
Export Citation:
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Assignee:
MAGIC LEAP INC (US)
International Classes:
G06F1/20; F28F21/00; G02B27/01; G06F1/16; H01L23/34; H01L23/373; H05K7/20
Attorney, Agent or Firm:
JUANG, Agnes (US)
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