Title:
THERMAL MASS FLOW RATE MEASUREMENT METHOD, THERMAL MASS FLOW RATE METER USING SAID METHOD, AND THERMAL MASS FLOW RATE CONTROLLER USING SAID THERMAL MASS FLOW RATE METER
Document Type and Number:
WIPO Patent Application WO/2015/151638
Kind Code:
A1
Abstract:
Because a sensor wire is heated through the application of a pulse signal to the sensor wire rather than the application of a DC voltage to the sensor wire, the strength of the signal supplied to the sensor wire is maintained while the energy amount is reduced or the energy amount supplied to the sensor wire is maintained while the signal strength is enhanced. Consequently, a mass flow rate measurement method using a thermal mass flow rate meter is provided in which it is possible to reduce heating from the sensor wire while suppressing the reduction of measurement accuracy or increase measurement accuracy while suppressing the increase of heating from the sensor wire.
Inventors:
SASAKI AKIRA (JP)
Application Number:
PCT/JP2015/054779
Publication Date:
October 08, 2015
Filing Date:
February 20, 2015
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
G01F1/696
Foreign References:
| JPH06222841A | 1994-08-12 | |||
| JPH09218065A | 1997-08-19 | |||
| JP2005300486A | 2005-10-27 | |||
| JPH1038652A | 1998-02-13 |
Attorney, Agent or Firm:
PROSPEC PATENT FIRM (JP)
Patent business corporation Pros Peck patent firm (JP)
Patent business corporation Pros Peck patent firm (JP)
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