Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL MASS INTEGRATION FOR HEAT PUMP
Document Type and Number:
WIPO Patent Application WO/2022/261195
Kind Code:
A1
Abstract:
Embodiments described herein include systems, devices, and methods for improved heating, ventilation, and air conditioning. In some embodiments, a system includes a housing, a thermal mass unit disposed in the housing and configured to thermally couple to a room side of a heat pump that is disposed outside of the housing, and a thermal coupling device coupled to the thermal mass unit and configured to transfer heat between the thermal mass unit and the room side of the heat pump. In some embodiments, the system can further include a heat exchanger thermally coupled to the thermal mass unit and the thermal coupling device. In some embodiments, the heat exchanger can transfer heat between the thermal mass unit and the thermal coupling device

Inventors:
COX MARSHALL (US)
KYMISSIS IOANNIS (US)
Application Number:
PCT/US2022/032657
Publication Date:
December 15, 2022
Filing Date:
June 08, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RADIATOR LABS INC (US)
International Classes:
F28D20/02; F24D11/00; F24D13/00; F24H7/06; F28F9/00
Foreign References:
US20180195809A92018-07-12
US20110042471A12011-02-24
US20110120167A12011-05-26
US20140166232A12014-06-19
US20190195519A12019-06-27
US20040114916A12004-06-17
US20090183853A12009-07-23
US20200292215A12020-09-17
ES2849225A12021-08-16
Attorney, Agent or Firm:
HUTTER, Christopher R. et al. (US)
Download PDF:
Claims:
Claims

1. A system, comprising: a housing; a thermal mass unit disposed in the housing and configured to thermally couple to a room side of a heat pump that is disposed outside of the housing; and a thermal coupling device at least partially disposed outside of the housing that is coupled to the thermal mass unit and configured to transfer heat between the thermal mass unit and the room side of the heat pump.

2. The system of claim 1, further comprising: a heat exchanger thermally coupled to and configured to transfer heat between the thermal mass unit and the thermal coupling device.

3. The system of claim 1, further comprising: a heat exchanger configured to transfer heat between the thermal coupling device and the room side of the heat pump.

4. The system of claim 1, wherein the thermal mass unit includes a space heating radiator.

5. The system of claim 1, wherein the thermal coupling device is removably coupled to the room side of the heat pump.

6. The system of claim 1, further comprising thermal insulation disposed between the thermal mass and the housing.

7. The system of claim 1, wherein the heat pump further includes an exterior side exposed to an outdoor environment.

8. The system of claim 1, wherein the housing is configured to be retrofitted to a space heating radiator.

9. The system of claim 1, further comprising a fan configured to induce forced convective heat transfer between the thermal mass unit and an indoor environment.

10. The system of claims 1, 2, or 5-9, further comprising: a heat exchanger configured to transfer heat between the thermal coupling device and the room side of the heat pump.

11. The system of any one of claims 1-4 or 6-9, wherein the thermal coupling device is removably coupled to the room side of the heat pump.

12. The system of any one of claims 1-3, or 5-9, wherein the thermal mass unit includes a space heating radiator.

13. The system of any one of claims 1-5 or 6-9, further comprising thermal insulation disposed between the thermal mass and the housing.

14. The system of any one of claims 1-6, 8, or 9, wherein the heat pump further includes an exterior side exposed to an outdoor environment.

15. The system of any one of claims 1-7 or 9, wherein the housing is configured to be retrofitted to a space heating radiator.

16. The system of any one of claims 1-8, further comprising a fan configured to induce forced convective heat transfer between the thermal mass unit and an indoor environment.

17. The system of any one of claims 1-9, wherein the thermal coupling device includes a heat pipe.

18. The system of any one of claims 1-9, further comprising a pump configured to move fluid through the thermal coupling device to carry heat between the room side of the heat pump and the thermal mass unit.

19. A system, comprising: a heat pump having an internal side exposed to an indoor environment; and a thermal coupling device coupled to the heat pump and configured to transfer heat between the internal side of the heat pump and a thermal mass unit spaced apart from the heat pump.

20. The system of claim 19, further comprising: a heat exchanger configured to be thermally coupled to the thermal mass unit and configured to transfer heat between the thermal coupling device and the thermal mass unit.

21. The system of claim 19, further comprising: a heat exchanger configured to be thermally coupled to the room side of the heat pump and configured to transfer heat between the room side of the heat pump and the thermal coupling device.

22. The system of claim 19, wherein the heat pump includes a window heat pump.

23. The system of claim 19, further comprising: a housing spaced apart from the heat pump; and the thermal mass unit disposed within the housing.

24. The system of any one of claims 19-23, wherein the thermal coupling device includes a heat pipe.

25. The system of any one of claims 19-23, further comprising: a heat exchanger configured to be thermally coupled to the thermal mass unit and configured to transfer heat between the thermal coupling device and the thermal mass unit.

26. The system of any one of claims 19 or 21-23 further comprising: a heat exchanger configured to be thermally coupled to the room side of the heat pump and configured to transfer heat between the room side of the heat pump and the thermal coupling device.

27. The system of any one of claims 19, 20, 22, or 23, wherein the heat pump includes a window heat pump.

28. The system of any one of claims 19-21 or 23, further comprising: a housing spaced apart from the heat pump; and the thermal mass unit disposed within the housing.

29. The system of any one of claims 19-22, further comprising a pump configured to move fluid through the thermal coupling device to carry heat between the room side of the heat pump and the and the thermal mass unit.

30. A system, comprising: a heat pump having an internal side exposed to an indoor environment; a housing disposed apart from the heat pump; a thermal mass unit disposed in the housing; and a thermal coupling device coupled to the thermal mass unit and the internal side of the heat pump, the thermal coupling device configured to transfer heat between the thermal mass unit and the internal side of the heat pump.

31. The system of claim 30, wherein the housing is placed in an indoor environment.

32. The system of claim 30, further comprising a heat exchanger thermally coupled to the thermal coupling device and the thermal mass unit, the heat exchanger configured to transfer heat between the thermal coupling device and the thermal mass unit.

33. The system of any one of claims 30-32, wherein the thermal coupling device includes a heat pipe.

34. The system of any one of claims 30-32, further comprising a pump configured to move fluid through the thermal coupling device to carry heat between the internal side of the heat pump and the thermal mass unit.

35. The system of claim 30 or 32, wherein the housing is placed in an indoor environment.

36. The system of claim 30 or 31, further comprising a heat exchanger thermally coupled to the thermal coupling device and the thermal mass unit, the heat exchanger configured to transfer heat between the thermal coupling device and the thermal mass unit.

37. A method, comprising: transferring heat between a room side of a heat pump and a thermal mass unit while the heat pump is in operation via a thermal coupling device, the thermal mass unit disposed within a housing remote from the heat pump; storing the heat in the thermal mass unit; and controlling release of heat from the thermal mass unit such that a target temperature of the room is maintained when the heat pump is not in operation.

38. The method of claim 37, wherein: heat is transferred between the room side of the heat pump and the thermal mass unit during a time period of low energy demand; and heat is released from the thermal mass unit during a time period of high energy demand.

Description:
THERMAL MASS INTEGRATION FOR HEAT PUMP

Cross Reference to Related Application

[0001] This application claims the benefit of and priority to U.S. Patent Application No. 63/208,098, filed June 8, 2021, the entire contents of which are hereby incorporated by reference.

Technical Field

[0002] Embodiments described herein generally relate to thermal management systems and methods of operating the same. In particular, embodiments described herein generally relate to systems and methods for managing the temperature of indoor spaces.

Background

[0003] Embodiments described herein relate to systems, devices, and methods for improved heating, ventilation, and air conditioning. A variety of systems and methods exist for heating and cooling the interiors of residential and commercial buildings. Conventional heat pumps and air conditioners encounter several operational issues. For example, single room window air conditioner units with heat pumps often run during peak usage hours (e.g., on afternoons of hot summer days). Utility companies often set energy prices higher at peak usage hours to discourage consumers from exhausting the energy grid. Additionally, conventional systems can struggle to quickly adjust the temperature of a room. Significant delays occur between designating a set temperature and reaching the set temperature.

Summary

[0004] Embodiments described herein include systems, devices, and methods for improved heating, ventilation, and air conditioning. In some embodiments, a system includes a housing, a thermal mass unit disposed in the housing and configured to thermally couple to a room side of a heat pump that is disposed outside of the housing, and a thermal coupling device coupled to the thermal mass unit and configured to transfer heat between the thermal mass unit and the room side of the heat pump. In some embodiments, the system can further include a heat exchanger thermally coupled to the thermal mass unit and the thermal coupling device. In some embodiments, the heat exchanger can transfer heat between the thermal mass unit and the thermal coupling device. In some embodiments, the system can further include a pump that moves fluid through the thermal coupling device to carry heat between the room side of the heat pump and the thermal mass unit. In some embodiments, the system can further include a heat exchanger that transfers heat between the thermal coupling device and the room side of the heat pump. In some embodiments, the thermal mass unit can include a space heating radiator. In some embodiments, the thermal coupling device can be removably coupled to the room side of the heat pump. In some embodiments, a thermal insulation can be disposed between the thermal mass and the housing. In some embodiments, the heat pump can include an exterior side exposed to an outdoor environment.

Brief Description of the Drawings

[0005] FIG. 1 is a block diagram of a thermal management system, according to an embodiment.

[0006] FIG. 2 is an illustration of a thermal management system, according to an embodiment.

[0007] FIG. 3 is a flow chart of a method of controlling a thermal management system, according to an embodiment.

Detailed Description

[0008] Heat transfer and management thereof are important areas of innovation of research. Commercial and residential buildings collectively waste billions of kilowatt-hours (kW-h) of energy each year in excessively heating or cooling buildings. Due, in part, to an ever-increasing demand on utilities and focus on environmental impact and cost savings, an improved heating and cooling system is required which can more efficiently, rapidly, and/or accurately deliver tempered air at one or more points of use. Conventional heat pumps and heat pump systems used in commercial and/or residential buildings are typically not designed to store energy or expend energy in a consistent manner. Rather, conventional heat pumps are idle for long periods of time, with intermittent periods of energy-intensive operation (often during peak energy usage hours with peak pricing). By shifting the time during which heat pumps operate and/or storing a portion of the energy generated during operation in a thermal mass, a consumer can significantly reduce energy consumption during peak usage hours. This provides economic benefits for the consumer, as well as more efficient grid management.

[0009] Storing the energy from heating or cooling operations in a thermal mass can in some instances save at least 20%, and in some cases, at least 30% of energy costs associated with thermal management of buildings. Some embodiments described herein can be related to or can integrate with thermal management systems described in U.S. Patent Publication No. 2018/0195809 (“the ‘809 publication”), filed April 3, 2015, entitled “Thermal Mass for Heat Pre-Load and Time-Controlled Dispersion in Building Heating Systems,” the entire disclosure of which is hereby incorporated by reference in its entirety.

[0010] FIG. 1 is a block diagram of a thermal management system 100, according to an embodiment. As shown, the thermal management system 100 includes a thermal coupling device 110 joining a housing 120 with a thermal mass unit 130 to a heat pump 140. In some embodiments, the thermal management system 100 can be implemented in a residential building, a commercial building, or any suitable dwelling unit. The thermal management system 100 can be implemented in room-scale heating or cooling operations. In some embodiments, the thermal management system 100 can include a central control unit for managing the transfer of heat throughout the thermal management system 100. In some embodiments, the central control unit can include a computer. In some embodiments, the central control unit can include a thermostat. In some embodiments, the central control unit can be controlled manually (i.e., by a user). In some embodiments, the central control unit can control the thermal management system automatically (i.e., via a series of algorithms and decision flow charts). In other words, changes to the management of thermal energy in the thermal management system 100 can be implemented manually or automatically based on temperature conditions in various portions of the thermal management system 100, or a room in which the thermal management system 100 is placed. In some cases, the thermal management system 100 can be operated based on power costs (e.g., using less energy during peak usage hours).

[0011] The heat pump 140 includes a room side exposed to an inside environment and a waste heat side. Typically, the waste heat side is exposed to an outside environment. In some embodiments, the outside environment can include atmospheric air. In some embodiments, the heat pump 140 can be at least partially underground, such that the outside environment includes ground (i.e., earth). In some embodiments, the heat pump 140 can be at least partially underwater, such that the outside environment includes water. The heat pump 140 can be, for example, a window air conditioning unit, a window heat pump, a window heating unit, split system heat pump, a ductless mini-split heat pump, or any other suitable device. The heat pump 140 can therefore be configured to condition (e.g., heat or cool) indoor air using the room side and reject excess heat energy (hot or cold) to the outside environment. In some instances, the heat pump 140 can be communicatively coupled to a thermostat, thermometer, and/or a thermocouple, which can be used to control the heat pump 140.

[0012] The thermal coupling device 110 is configured to be coupled to the heat pump 140 on one end and coupled to the thermal mass unit 130 and/or the housing 120 on another end. The thermal coupling device 110 can include a heat transfer fluid and a pump configured to move the heat transfer fluid between the heat pump 140 and the thermal mass unit 130. For example, the thermal coupling device 110 can include a heat exchanger thermally coupled to the heat pump 140 and another heat exchanger thermally coupled to the thermal mass unit 130. The heat transfer fluid can be any suitable gas or liquid, including mixtures of gas and liquid phases. In some instances, the heat transfer fluid can include air, water (or water vapor/steam), propylene glycol, ethylene glycol, oil, salt solutions, wax, molten metal, etc. In some embodiments, the heat transfer fluid can include hot air (i.e., air heated by the heat pump 140 to a temperature above the surrounding environment). The heat transfer fluid can be pumped between the heat exchangers to transfer heat between the heat pump 140 and the thermal mass unit 120. In addition or alternatively, the thermal coupling device 110 can include a heat pipe (e.g., a sealed thermal transfer device containing a working fluid that passively conducts heat between the heat pump 140 and the thermal mass unit 130) or any other suitable system operable to transfer heat energy. In some embodiments, the thermal coupling device 110 can transfer heat passively (e.g., without pumps). In some embodiments, the thermal coupling device 110 can be activated to transfer heat between the heat pump 140 and the thermal mass unit based on a thermal condition detected by the thermal management system 100. For example, if the difference in temperature between the thermal mass unit 130 and the heat pump 140 exceeds a threshold value, the pump can engage to transfer heat between the thermal mass unit 130 and the heat pump 140. In some embodiments, heat transfer between the thermal mass unit 130 and the heat pump 140 can be based on a prescribed set time. For example, during summer, heat can be transferred from the thermal mass unit 130 to the heat pump 140 during the night to cool off the thermal mass unit 140, effectively storing or banking the cold from the cooler night temperatures for later use during the day. In some embodiments, heat transfer between the thermal mass unit 130 and the heat pump 140 can be based on energy costs. In some embodiments, heat transfer between the thermal mass unit 130 and the heat pump 140 can be based on energy production. For example, the heat pump 140 can be run during the day, when on-building solar panels are collecting energy, reducing or eliminating the need for battery storage.

[0013] The heat pump 140 and the housing 120 can be spaced apart. Similarly stated, the housing 120 and/or the thermal mass unit 130 may not be affixed to or disposed in the same housing as the heat pump 140. In some embodiments, the housing 120 can be a stand-alone device such that the thermal mass unit 130 and/or the thermal coupling device 110 can be retrofitted to heat pump 140. In some embodiments, housing 120 can be a stand-alone device containing the thermal mass unit 130 and suitable for being retrofitted to an existing heat pump 140 via the thermal coupling device 110. In some embodiments, the housing 120 and/or the thermal mass unit 130 can be configured to be retrofitted to an existing radiator configured for space heating (e.g., a cast iron steam radiator). In some instances, the housing 120 can include a fan for dispersion of heat and/or cold from the thermal mass unit 130 and into the room. Similarly stated, the fan can be configured to induce air flow over the thermal mass unit 130 (or a heat exchanger thermally coupled to the thermal mass unit), resulting in forced convective heat transfer between the thermal mass unit 130 and an indoor environment. In some instances, the fan can be disposed in the housing 120. In some embodiments, the fan can be disposed outside the housing 120. In some instances, the housing 120 can be configured to be positioned in the same room as the heat pump 140. In other instances, the housing 120 can be configured to be positioned in a different room from the heat pump, such as a utility closet, built into a wall, ceiling, or floor, disposed in a basement or crawlspace, disposed in an attic, etc.

[0014] In some embodiments, the thermal coupling device 110 can follow a direct or substantially straight path from the heat pump 140 to the thermal mass unit 120. In some embodiments, the thermal coupling device 110 can follow in indirect or roundabout path from the heat pump 140 to the thermal mass unit 120.

[0015] In some embodiments, the heat pump 140 can be operated to induce a change in temperature from the end of the thermal coupling device 110 coupled to the heat pump 140 to the end of the thermal coupling device 110 coupled to the housing 120 and/or thermal mass unit 130 of at least about 0.1 °C, at least about 0.2 °C, at least about 0.3 °C, at least about 0.4 °C, at least about 0.5 °C, at least about 0.6 °C, at least about 0.7 °C, at least about 0.8 °C, at least about 0.9 °C, at least about 1 °C, at least about 2 °C, at least about 3 °C, at least about 4 °C, at least about 5 °C, at least about 10 °C, at least about 20 °C, at least about 30 °C, at least about 40 °C, at least about 50 °C, at least about 60 °C, at least about 70 °C, at least about 80 °C, at least about 90 °C, at least about 100 °C, at least about 110 °C, at least about 120 °C, at least about 130 °C, at least about 140 °C, at least about 150 °C, at least about 160 °C, at least about 170 °C, at least about 180 °C, at least about 190 °C, or at least about 200 °C, inclusive of all values and ranges therebetween.

[0016] In some embodiments, the thermal coupling device 110 can be removably coupled to the heat pump 140. In some embodiments, the thermal coupling device 110 can be configured to be removably coupled to the housing 120 and/or the thermal mass unit 130. In some embodiments, the thermal coupling device 110 can transfer heat from the heat pump 140 (i.e., a room side of the heat pump 140) to the thermal mass unit 130 during a time period of low energy demand to capture or “bank” heat or cold for later use. In some embodiments, heat can be released from the thermal mass unit 130 during a time period of high energy demand. In some embodiments, the thermal coupling device 110 can be coupled to the housing 120 and/or the thermal mass unit 130 via a first heat exchanger (not shown). In some embodiments, the thermal coupling device 110 can be coupled to the heat pump 140 via a second heat exchanger (not shown).

[0017] In some instances, the thermal mass unit 130 can include a component with a high heat capacity for storage of heat or cold. In some embodiments, the thermal mass unit 130 can store heat, such that the thermal mass unit 130 maintains a temperature that is higher than a temperature of a surrounding environment. In some embodiments, the thermal mass unit 130 can maintain a temperature that is higher than the temperature of the surrounding environment by at least about 5 °C, at least about 10 °C, at least about 15 °C, at least about 20 °C, at least about 25 °C, at least about 30 °C, at least about 35 °C, at least about 40 °C, at least about 45 °C, at least about 50 °C, at least about 55 °C, at least about 60 °C, at least about 65 °C, at least about 70 °C, at least about 75 °C, at least about 80 °C, at least about 85 °C, at least about 90 °C, at least about 95 °C, at least about 100 °C, inclusive of all values and ranges therebetween. In some embodiments, the thermal mass unit 130 can store cold, such that the thermal mass unit 130 maintains a temperature that is lower than the temperature of the surrounding environment. In some instances, the thermal mass unit 130 can maintain a temperature that is lower than the temperature of the surrounding environment by at least about 5 °C, at least about 10 °C, at least about 15 °C, at least about 20 °C, at least about 25 °C, at least about 30 °C, at least about 35 °C, at least about 40 °C, at least about 45 °C, at least about 50 °C, at least about 55 °C, at least about 60 °C, at least about 65 °C, at least about 70 °C, at least about 75 °C, at least about 80 °C, at least about 85 °C, at least about 90 °C, at least about 95 °C, at least about 100 °C, inclusive of all values and ranges therebetween.

[0018] In some embodiments, the housing 120 and the thermal mass unit 130 can be composed of materials selected to be used for a particular climate. In some embodiments, the thermal mass 130 can include a steam radiator. In some embodiments, the thermal mass unit 130 can include a space heating radiator. In some embodiments, the thermal mass unit 130 can include a cast iron radiator configured to heat rooms with steam heat. In some embodiments, the thermal mass 130 can include cast iron, carbon steel, stainless steel, mild steel, aluminum, or any combination thereof. In some embodiments, the thermal mass unit 130 can be composed of a material with a high heat capacity and a high density. In some embodiments, the thermal mass unit 130 can include a phase change material thermally coupled to a radiator (not shown), the phase change material configured to store heat from the radiator and/or the heat pump 140. In some embodiments, the thermal mass unit 130 can include a decommissioned radiator (e.g., a steam radiator that has been disconnected from a source of steam). In some embodiments, the thermal mass unit 130 can include a decommissioned radiator plugged and/or filled with additional materials (e.g., water, a phase-change material, etc.) to increase its thermal mass. In some embodiments, the thermal mass unit 130 can have a specific heat capacity of at least about 200 J/kg-K, at least about 250 J/kg-K, at least about 300 J/kg-K, at least about 350 J/kg-K, at least about 400 J/kg-K, at least about 450 J/kg-K, at least about 500 J/kg-K, at least about 550 J/kg-K, at least about 600 J/kg-K, at least about 650 J/kg-K, at least about 700 J/kg-K, at least about 750 J/kg-K, at least about 800 J/kg-K, at least about 850 J/kg-K, or at least about 900 J/kg-K, inclusive of all values and ranges therebetween.

[0019] As shown, the thermal management system 100 includes one thermal mass unit 130. In some embodiments, the thermal management system 100 can include multiple thermal mass units 130. In some embodiments, the thermal management system 100 can include 2, 3, 4, 5, 6, 7, 8, 9, 10 or more thermal mass units 130. In some embodiments, the thermal management system 100 can include multiple thermal mass units 130 connected in series in a cascading temperature pattern. F or example, a first thermal mass unit can maintain a temperature of about 70 °C, while a second thermal mass unit just downstream (i.e., further away from the heat pump 140 along the length of the thermal coupling device 110) of the first thermal mass unit can maintain a temperature of about 60 °C, while a third thermal mass unit just downstream of the second thermal mass unit can maintain a temperature of about 50 °C.

[0020] In some embodiments, the thermal management system 100 can be incorporated into a building with multiple heat pumps 140. For example, each unit in an apartment building may contain one or more window-mounted heat pumps and/or air conditioning units. In such cases, heat can be transferred from one portion of the building to another portion of the building. In some embodiments, the thermal management system 100 can employ room-to-room thermal transfer. In other words, heat can be transferred from one or more heat pumps 140 in a first room to one or more thermal mass units 130 in a second room, into which the heat can be stored and/or released. As an example, in a building with multiple thermal mass units 130 and multiple heat pumps 140, heat can be transferred from one or more heat pumps 140 in rooms on the south side of a building to one or more thermal mass units 140 in rooms on the north side of the building. In some embodiments, heat can be transferred from individual heat pumps located in rooms to a central heating or cooling system. For example, the thermal coupling device 110 can couple room-scale heat pump(s) to radiator(s) coupled to a central boiler and/or domestic hot water supply. In this way heat can be transferred from room-sited heat-pumps to pre-heat or pre-cool a building- wide HVAC and/or hot water system. In some instances, such heat or cold can be stored in a central boiler as heated water/steam or other similar working fluid for later release. Similarly stated, in some embodiments, the thermal mass unit 130 can be or include the entire thermal mass associated with a central boiler or water heater.

[0021] In some embodiments, building-scale transfer of heat can be implemented based on forecasted weather, including forecasted solar energy incident upon the building. For example, a forecast may call for sunny weather in the late afternoon, which would be expected to heat the west side of the building. In anticipation of this sunny weather, heat can be drawn away from the thermal mass units 130 on the west side of the building. The thermal mass units 130 are consequently cooled off enough such that they can be used to cool off the west side of the building when the sunlight hits. As another example, while the sun is shining on the west side of the building, room-scale cooling may not be necessary in eastern and northern facing rooms. Room-scale air conditioning units, however, may be operated with their cool output at least partially redirected into the central HVAC system via the thermal coupling device, the central HVAC system can then supplement room-scale cooling in rooms with western or southern exposures using heat energy generated in the northern and eastern-facing rooms.

[0022] In some embodiments, the housing 120 can include one or more layers of insulative material. In other words, one or more layers of insulative material can form a barrier between the thermal mass unit 130 and the surrounding environment. In some embodiments, the insulative material can include fiberglass, mineral wool, cellulose, polystyrene, natural fibers, insulation facings, phenolic foam, cementitious foam, urea-formaldehyde foam, perlite, vermiculite, polyurethane, polyisocyanurate, or any combinations thereof. In some embodiments, a thermostat, thermometer, and/or a thermocouple can be disposed inside the housing 120. In some embodiments, a thermostat, a thermometer, and/or a thermocouple can be in physical contact with the thermal mass unit 130. In some embodiments, a thermostat, a thermometer, and/or a thermocouple can be disposed just outside of the housing 120. In some embodiments, a refrigerant and/or a refrigerant management system can be disposed in the housing 120. In some embodiments, one or more heating elements can be disposed in the housing 120. In some embodiments, a thermostat, a thermometer, and/or thermocouple can be disposed in a room (e.g., of a building) with the housing 120 and/or the heat pump 140. In such an embodiment, thermostat, thermometer, and/or thermocouple can be used to control the operation of the heat pump 140, the release of heat and/or cold from the thermal mass unit 130, and/or transfer of heat and/or cold from the heat pump 140 to the thermal mass unit 130.

[0023] FIG. 2 shows a thermal management system 200, according to an embodiment. As shown, the thermal management system 200 includes a thermal coupling device 210, a housing 220, a thermal mass unit 230, a first heat exchanger 235, a heat pump 240, and a second heat exchanger 235. In some embodiments, the thermal coupling device 210, the housing 220, the thermal mass unit 230, and the heat pump 240 can be the same or substantially similar to the thermal coupling device 110, the housing 120, the thermal mass unit 130, and the heat pump 140 as described above with reference to FIG. 1. Thus, certain aspects of the thermal coupling device 210, the housing 220, the thermal mass unit 230, and the heat pump 240 are not described in greater detail herein.

[0024] As shown, the heat pump 240 includes a room side exposed to an interior environment and an exterior side exposed to an exterior environment. In some embodiments, the exterior environment can be an outdoor environment. In some embodiments, the interior environment can be the interior of a commercial building, a residential building, or any other temperature controlled environment.

[0025] In some embodiments, the first heat exchanger 235 can be integrated into and/or configured to be coupled to the thermal mass unit 230. For example, the first heat exchanger 235 can be sized and shaped such that portions of the first heat exchanger 235 are placed between fins of the thermal mass unit 230. In some embodiments, the first heat exchanger 235 can be disposed at an interface between the thermal mass unit 230 and the thermal coupling device 210. In some embodiments, the first heat exchanger 235 can include a double tube heat exchanger, a shell and tube heat exchanger, a tube in tube heat exchanger, a plate heat exchanger, or any other type of heat exchanger, or combinations thereof. In some embodiments, the first heat exchanger 235 can be integrated into a block designed and shaped to attach to the thermal mass unit 230. In some embodiments, the first heat exchanger 235 can extend around a perimeter of the thermal mass unit 230. In some embodiments, the first heat exchanger 235 can be designed to be integrated into a phase change material inside the thermal mass unit 230.

[0026] In some embodiments, the second heat exchanger 245 can be integrated into and/or configured to be coupled to the heat pump 240. For example, the second heat exchanger 245 can be sized and shaped such that portions of the second heat exchanger 245 are placed between fins of the heat pump 240. In some embodiments, the second heat exchanger 245 can be disposed at an interface between the heat pump 240 and the thermal coupling device 210. In some embodiments, the second heat exchanger 245 can include a double tube heat exchanger, a shell and tube heat exchanger, a tube in tube heat exchanger, a plate heat exchanger, or any other type of heat exchanger, or combinations thereof. In some embodiments, the second heat exchanger 245 can be configured to be removably coupled to the heat pump 240. For example, the second heat exchanger 245 can be shaped and sized to couple to the room side of a window heat pump or window air conditioning unit. [0027] FIG. 3 is a flow chart of a method 300 of controlling a thermal management system (e.g., the thermal management system 100, as described above with reference to FIG. 1), according to an embodiment. The method 300 includes collecting weather data at 301, capturing and storing heat or cold based on the temperature data at 302, releasing stored heat or cold to supplement a thermal management strategy at 303, and optionally adjusting the thermal management strategy based on solar energy data at 304.

[0028] The method 300 includes collecting weather data at step 301. The weather data can include the current outdoor temperature. In some embodiments, the temperature data can include one or more forecasted outdoor temperatures. In some embodiments, the forecasted outdoor temperatures can extend into the future by about 1 hour, about 2 hours, about 3 hours, about 4 hours, about 5 hours, about 6 hours, about 7 hours, about 8 hours, about 9 hours, about 10 hours, about 11 hours, about 12 hours, about 13 hours, about 14 hours, about 15 hours, about 16 hours, about 17 hours, about 18 hours, about 19 hours, about 20 hours, about 21 hours, about 22 hours, about 23 hours, about 1 day, about 2 days, about 3 days, about 4 days, about 5 days, about 6 days, about 7 days, about 8 days, about 9 days, about 10 days, about 11 days, about 12 days, about 13 days, about 14 days, or about 15 days, inclusive of all values and ranges therebetween. In some embodiments, the current outdoor temperature can be measured by a thermometer and/or thermocouple placed outdoors near the thermal management system. In some embodiments, the current outdoor temperature and/or the forecasted outdoor temperatures can be communicated via a weather service (e.g., The Weather Channel®, AccuWeather®, a local weather service, etc.). In some embodiments, the weather data can include humidity, precipitation, wind speed, atmospheric pressure, forecasted clouds, dew point, and/or any other current or forecasted weather information.

[0029] The method 300 further includes capturing and storing heat or cold based on the weather data at 302. In some embodiments, capturing and storing the heat or cold can include activating a heat pump (e.g., the heat pump 140, as described above with reference to FIG. 1) during off-peak hours to store heat or cold in a thermal mass (e.g., the thermal mass 130, as described above with reference to FIG. 1). For example, during a summer day, the outdoor temperature may be about 20 °C at 3:00 AM, and the daily temperature is forecasted to peak at 35 °C at 3:00 PM. In such a situation, air conditioning use throughout the geographic area would likely peak around 3:00 PM, substantially straining the electricity grid. Utility companies may accordingly use peak pricing at 3:00 PM to discourage excessive energy use. By operating the heat pump at 3:00 AM during non-peak hours, a user can store or bank cold in the thermal mass for later use. This takes advantage of off-peak pricing while reducing strain on the energy grid.

[0030] The method 300 further includes releasing stored heat or cold to supplement the thermal management strategy at 303. In some embodiments, the stored heat or cold can be released from the thermal mass without activating the heat pump. In some embodiments, the stored heat or cold can be released from the thermal mass in addition to activating the heat pump. In some embodiments, the amount of heat or cold released from the thermal mass can be based on forecasted outdoor temperatures. For example, if the outdoor temperature is 27 °C at 11:00 AM, and the outdoor temperature is not anticipated to rise above 27 °C for the remainder of the day, the thermal management system can release cold from the thermal mass in a steady manner throughout the day. If the if the outdoor temperature is 27 °C at 11 :00 AM, and the outdoor temperature is forecasted to reach 35 °C at 3:00 PM, the thermal management system can minimize or delay release of cold from the thermal mass for when the outdoor temperature is warmer (i.e., during peak hours). In other words, the release of heat or cold from the thermal mass can be timed to maximize the user’s energy cost savings by releasing larger amounts of heat or cold from the thermal mass during peak hours.

[0031] The method 300 optionally includes adjusting the thermal management strategy based on solar energy data at 304. If the building in which the thermal management system is disposed includes solar panels for solar power, this can affect the thermal management strategy. For example, if the weather forecast calls for sunny weather during peak energy usage hours (e.g., 3:00 PM), the solar energy can supplement the energy the grid provides to the heat pump. In such a situation, the actual peak usage by the building may be during cooler, cloudier times of the day. This can affect the implementation of release of heat or cold from the thermal mass. For example, the heat or cold from the thermal mass can be released during cloudier times of day, if the energy needs of the thermal management system are forecasted to be significantly supplemented (via solar energy) during peak hours. In some embodiments, the thermal management system can be adjusted and/or optimized over time to more precisely tune the usage of grid energy in harmony with the capture of solar energy. [0032] As used in this specification, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, the term “a member” is intended to mean a single member or a combination of members, “a material” is intended to mean one or more materials, or a combination thereof.

[0033] The term “substantially” when used in connection with “cylindrical,” “linear,” and/or other geometric relationships is intended to convey that the structure so defined is nominally cylindrical, linear or the like. As one example, a portion of a pipe that is described as being “substantially linear” is intended to convey that, although linearity of the portion is desirable, some non-linearity can occur in a “substantially linear” portion. Such non-linearity can result from manufacturing tolerances, or other practical considerations (such as, for example, the pressure or force applied to the support member). Thus, a geometric construction modified by the term “substantially” includes such geometric properties within a tolerance of plus or minus 5% of the stated geometric construction. For example, a “substantially linear” portion is a portion that defines an axis or center line that is within plus or minus 5% of being linear.

[0034] As used herein, the term “set” and “plurality” can refer to multiple features or a singular feature with multiple parts. For example, when referring to a set of pipes, the set of pipes can be considered as one pipe with multiple portions, or the set of pipes can be considered as multiple, distinct pipes. Thus, a set of portions or a plurality of portions may include multiple portions that are either continuous or discontinuous from each other. A plurality of particles or a plurality of materials can also be fabricated from multiple items that are produced separately and are later joined together (e.g., via mixing, an adhesive, or any suitable method).

[0035] As used herein, “space heating radiator” can refer to a source of heat configured for space heating (e.g., heating a room), at least in part, via radiative heat transfer. In some instances, a space heating radiator can receive heat energy from a central source (e.g., a boiler). In other instances, a space heating radiator can receive electric energy and convert the electric energy into radiative heat. In yet other instances, a space heating radiator can locally generate heat energy, for example through the burning of a fuel.

[0036] While embodiments described herein generally include heat pumps, it should be apparent to those skilled in the art that a thermal coupling device (e.g., the thermal coupling device 110) can also be attached to a space heater, a swamp cooler, or other suitable heat or cold sources.

[0037] Various concepts may be embodied as one or more methods, of which at least one example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments. Put differently, it is to be understood that such features may not necessarily be limited to a particular order of execution, but rather, any number of threads, processes, services, servers, and/or the like that may execute serially, asynchronously, concurrently, in parallel, simultaneously, synchronously, and/or the like in a manner consistent with the disclosure. As such, some of these features may be mutually contradictory, in that they cannot be simultaneously present in a single embodiment. Similarly, some features are applicable to one aspect of the innovations, and inapplicable to others.

[0038] In addition, the disclosure may include other innovations not presently described. Applicant reserves all rights in such innovations, including the right to embodiment such innovations, file additional applications, continuations, continuations-in-part, divisionals, and/or the like thereof. As such, it should be understood that advantages, embodiments, examples, functional, features, logical, operational, organizational, structural, topological, and/or other aspects of the disclosure are not to be considered limitations on the disclosure as defined by the embodiments or limitations on equivalents to the embodiments. Depending on the particular desires and/or characteristics of an individual and/or enterprise user, database configuration and/or relational model, datatype, data transmission and/or network framework, syntax structure, and/or the like, various embodiments of the technology disclosed herein may be implemented in a manner that enables a great deal of flexibility and customization as described herein.

[0039] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.

[0040] As used herein, in particular embodiments, the terms “about” or “approximately” when preceding a numerical value indicates the value plus or minus a range of 10%. Where a range of values is provided, it is understood that each intervening value, to the tenth of the unit of the lower limit unless the context clearly dictates otherwise, between the upper and lower limit of that range and any other stated or intervening value in that stated range is encompassed within the disclosure. That the upper and lower limits of these smaller ranges can independently be included in the smaller ranges is also encompassed within the disclosure, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included in the disclosure.

[0041] The phrase “and/or,” as used herein in the specification and in the embodiments, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0042] As used herein in the specification and in the embodiments, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactly one of,” or, when used in the embodiments, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e., “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the embodiments, shall have its ordinary meaning as used in the field of patent law. [0043] As used herein in the specification and in the embodiments, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and/or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

[0044] In the embodiments, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of’ and “consisting essentially of’ shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.

[0045] While specific embodiments of the present disclosure have been outlined above, many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, the embodiments set forth herein are intended to be illustrative, not limiting. For example, embodiments described herein generally describe a thermal mass unit within a housing. It should be understood, however, that in some instances, the thermal mass unit may be provided without a housing. Various changes may be made without departing from the spirit and scope of the disclosure. Where methods and steps described above indicate certain events occurring in a certain order, those of ordinary skill in the art having the benefit of this disclosure would recognize that the ordering of certain steps may be modified and such modification are in accordance with the variations of the invention. Additionally, certain of the steps may be performed concurrently in a parallel process when possible, as well as performed sequentially as described above. The embodiments have been particularly shown and described, but it will be understood that various changes in form and details may be made.