Title:
THERMAL PEELING METHOD FOR MACHINING INSPECTION OBJECTS
Document Type and Number:
WIPO Patent Application WO/2019/031533
Kind Code:
A1
Abstract:
A thermal peeling method for machining inspection objects, the method including steps (I) and (II) below. Step (I): a step for sticking a plurality of machining inspection objects to an adhesive surface of an adhesive layer (X1) of an adhesive sheet that includes the adhesive layer (X1) and a non-adhesive, thermally expandable base material that includes a resin and thermally expandable particles. Step (II): a step for heating a portion of the thermally expandable base material to at least the temperature at which the thermally expandable particles expand and selectively peeling off a portion of the plurality of machining inspection objects.
Inventors:
AKUTSU TAKASHI (JP)
OKAMOTO NAOYA (JP)
NAKAYAMA TAKEHITO (JP)
OKAMOTO NAOYA (JP)
NAKAYAMA TAKEHITO (JP)
Application Number:
PCT/JP2018/029699
Publication Date:
February 14, 2019
Filing Date:
August 08, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J5/00
Foreign References:
| JP2002064131A | 2002-02-28 | |||
| JP2000248240A | 2000-09-12 | |||
| JP2003064329A | 2003-03-05 | |||
| JPH11354556A | 1999-12-24 | |||
| JP2013125756A | 2013-06-24 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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