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Patent Searching and Data


Title:
THERMAL PRINT HEAD, THERMAL PRINTER, AND METHOD FOR MANUFACTURING THERMAL PRINT HEAD
Document Type and Number:
WIPO Patent Application WO/2021/205904
Kind Code:
A1
Abstract:
This thermal print head comprises a substrate, a resistor layer, and a wiring layer. The substrate is composed of a crystal semiconductor and has a principal surface facing the thickness direction. The resistor layer is supported on the substrate and has a plurality of heat generating parts arranged in a principal scanning direction. The wiring layer is supported on the substrate and constitutes a current-carrying path to the plurality of heat generating parts. The wiring layer includes, for each of the plurality of heat generating parts: an electroconductive part having a resistance value per unit length in a sub scanning direction that is lower than the heat generating parts; and a sub heat generating part having a resistance value per unit length in the sub scanning direction that is a value between the resistance values of the heat generating parts and the electroconductive parts. The substrate has a protrusion which protrudes from the principal surface and extends in the principal scanning direction. The heat generating parts, the sub heat generating part, and the electroconductive part are formed on the protrusion. The sub heat generating part is sandwiched between the heat generating part and the electroconductive part in the sub scanning direction.

Inventors:
KIMOTO SATOSHI (JP)
Application Number:
PCT/JP2021/012824
Publication Date:
October 14, 2021
Filing Date:
March 26, 2021
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
B41J2/335; B41J2/345
Foreign References:
JP2019166824A2019-10-03
JP2019014233A2019-01-31
JP2018176549A2018-11-15
JPH04288244A1992-10-13
JP2005205821A2005-08-04
JPH10138541A1998-05-26
CN109484039A2019-03-19
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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