Title:
THERMAL SPRAY SLURRY
Document Type and Number:
WIPO Patent Application WO/2019/181861
Kind Code:
A1
Abstract:
Provided is a thermal spray slurry in which coagulation of thermal spray particles does not easily occur. This thermal spray slurry contains: thermal spray particles formed of ceramic; a dispersion medium in which the thermal spray particles are dispersed; and a dispersant that improves the dispersion stability of the thermal spray particles with respect to the dispersion medium. In addition, the dispersant contains: a first dispersant which is at least one among an organic acid having a molecular weight of at least 1000 or a salt thereof; and a second dispersant which is an organic acid having a molecular weight of 40 to 400.
Inventors:
MASUDA TAKAYA (JP)
SUGIMURA KAZUYA (JP)
SUGIMURA KAZUYA (JP)
Application Number:
PCT/JP2019/011199
Publication Date:
September 26, 2019
Filing Date:
March 18, 2019
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C23C4/11
Domestic Patent References:
| WO2014142017A1 | 2014-09-18 |
Foreign References:
| JP2016006238A | 2016-01-14 | |||
| JP2011037702A | 2011-02-24 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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