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Patent Searching and Data


Title:
THERMAL SPRAYING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/114904
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing the ignition and dusting of a thermal spraying material for use in thermite spraying and improving the adhesiveness of the thermal spraying material. A thermal spraying material which comprises a refractory material powder and metallic Si powder and which is to be sprayed on a surface to be coated by using oxygen or an oxygen-containing gas as a carrier gas, melted by the combustion and heat generation of the metallic Si powder, and then adhered to the surface to be coated, wherein: the content of the metallic Si powder in the whole thermal spraying material is adjusted to 10 to 25mass%; the median diameter of the metallic Si powder is adjusted to 10μm or less; and the content of metallic Si powder particles having sizes of 2μm or less in the whole metallic Si powder is adjusted to 8mass% or less.

Inventors:
HONDA KAZUHIRO (JP)
MATSUI TAIJIROU (JP)
Application Number:
PCT/JP2014/079584
Publication Date:
August 06, 2015
Filing Date:
November 07, 2014
Export Citation:
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Assignee:
KROSAKIHARIMA CORP (JP)
International Classes:
C23C4/04; C01B33/02; C04B41/87; C23C4/10; C23C4/12
Foreign References:
JP2007284707A2007-11-01
JP4657172B22011-03-23
Attorney, Agent or Firm:
EIWA PATENT FIRM (JP)
Patent business corporation English-Japanese patent firm (JP)
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