Title:
THERMAL STORAGE SHEET, RESIN PELLET, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/162596
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a thermal storage sheet having excellent conformability and heat resistance. The present invention further addresses the problem of providing a resin pellet and a molded article. The thermal storage sheet according to the present invention contains: microcapsules encapsulating a heat storage material; a first resin having an olefin-derived repeating unit and a hydrophilic group; and a second resin that is different from the first resin and that has an olefin-derived repeating unit. The capsule wall of the microcapsules contains at least one resin W selected from the group consisting of polyurethane urea, polyurethane, and polyurea.
Inventors:
HATTA MASAHIRO (JP)
MIYASAKA REI (JP)
MIYASAKA REI (JP)
Application Number:
PCT/JP2023/003036
Publication Date:
August 31, 2023
Filing Date:
January 31, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08J5/18; C08G18/08; C08G18/76; C08L23/04; C08L23/10; C08L23/26; C08L75/00; C09K5/06
Domestic Patent References:
| WO2021251008A1 | 2021-12-16 | |||
| WO2020110662A1 | 2020-06-04 | |||
| WO2020110661A1 | 2020-06-04 | |||
| WO2021241167A1 | 2021-12-02 | |||
| WO2020174929A1 | 2020-09-03 | |||
| WO2022054495A1 | 2022-03-17 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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