Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL TREATMENT DEVICE AND THERMAL TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2011/122029
Kind Code:
A1
Abstract:
Disclosed is a thermal treatment device comprising: a treatment chamber; a heating source which is arranged in the treatment chamber and can emit an infrared ray; and a support member which is arranged in the treatment chamber and can support a material of interest so that the material faces the heating source. The material is thermally treated by a radiant heat generated by the action of the infrared ray emitted from the heating source. The support member is so arranged as to be overlaid only on a part of the material, and the material-side surface of the support member has multiple protrusions on which the material is to be supported.

More Like This:
Inventors:
NISHIDA, Koushi (())
西田光志 (())
KOHTOKU, Yukihide (())
Application Number:
JP2011/001928
Publication Date:
October 06, 2011
Filing Date:
March 30, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町22番22号 Osaka, 〒5458522, JP)
KOYO THERMO SYSTEMS CO., LTD. (229 Kabata-cho, Tenri-shi Nara, 84, 〒6320084, JP)
光洋サーモシステム株式会社 (〒84 奈良県天理市嘉幡町229番地 Nara, 〒6320084, JP)
NISHIDA, Koushi (())
International Classes:
F27D5/00; F27B17/00; F27D11/02
Foreign References:
JPH01153497U
JP2003021468A
JP2002267370A
JP2004037044A
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (Osaka-Marubeni Bldg, 5-7 Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, 〒5410053, JP)
Download PDF:
Claims: