THERMALLY CONDUCTCIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET, AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2011/001760

A1

Provided are a thermally conductive pressure-sensitive adhesive sheet which is flexible and has high thermal conductivity and flame retardancy, a thermally conductive pressure-sensitive adhesive composition which is a material for the thermally conductive pressure-sensitive adhesive sheet, and an electronic component equipped with the thermally conductive pressure-sensitive adhesive sheet. The thermally conductive pressure-sensitive adhesive composition (E) comprises 100 parts by mass of at least one polymer (S) selected from a group consisting of rubbers, elastomers, and resins, 150-2000 parts by mass of a powder of expanded graphite (B), and 75-850 parts by mass of a polyphosphate (C), wherein the polyphosphate (C) has a viscosity at 25ºC of 7,000 mPa∙s or higher and is always liquid at atmospheric pressure in a temperature range of 15-100ºC. The thermally conductive pressure-sensitive adhesive sheet (F) is obtained from the thermally conductive pressure-sensitive adhesive composition (E).

JPWO2015194523	Polarizer, polarizing plate with adhesive and image display device
JP2006124587	PRESSURE-SENSITIVE ADHESIVE PAPER

KUMAMOTO TAKUROU (JP)
NISHIOKA RYOKO (JP)

PCT/JP2010/058766

January 06, 2011

May 24, 2010

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ZEON CORP (JP)
KUMAMOTO TAKUROU (JP)
NISHIOKA RYOKO (JP)

C09J201/00; C09J7/10; C09J9/00; C09J11/04; C09J11/06; C09J133/06; C09J151/06; H01L23/36

WO2007116686A1

2007-10-18

JP2003020462A	2003-01-24
JPH11323269A	1999-11-26
JP2001271044A	2001-10-02
JPH07331201A	1995-12-19

HOSHINO, Tetsuro et al. (JP)
Tetsuro Hoshino (JP)

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