Title:
THERMALLY CONDUCTIVE ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/163027
Kind Code:
A1
Abstract:
Provided is a thermally conductive adhesive agent composition containing an adhesive resin and graphene having a two-dimensional structure. The content of the graphene having a two-dimensional structure is preferably 15 to 200 parts by mass, inclusive, relative to 100 parts by mass of the adhesive resin. Furthermore, the glass transition temperature (Tg) of the adhesive resin is preferably -70 to 50 °C, inclusive. The thermally conductive adhesive agent composition has excellent thermal conductivity.
Inventors:
YOSHINOBU TAKEO (JP)
ICHIKAWA ISAO (JP)
ICHIKAWA ISAO (JP)
Application Number:
PCT/JP2021/038059
Publication Date:
August 04, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/04; C09J7/38; C09J201/00; H01L23/373
Domestic Patent References:
| WO2012086387A1 | 2012-06-28 | |||
| WO2012060468A1 | 2012-05-10 | |||
| WO2015181982A1 | 2015-12-03 |
Foreign References:
| JP2015227444A | 2015-12-17 | |||
| JP2018035010A | 2018-03-08 | |||
| CN110951409A | 2020-04-03 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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