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Title:
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/044701
Kind Code:
A1
Abstract:
Provided is a thermally conductive adhesive composition, comprising: a) from 0.5 to 30%, preferably from 2 to 20% by weight of an epoxy resin, b) from 0.5 to 30%, preferably from 2 to 20% by weight of an anhydride, c) from 0.1 to 5%, preferably from 0.5 to 3.5% by weight of a catalyst, and d) from 50 to 98%, preferably from 60 to 95% by weight of a metal filler, based on the total weight of the thermally conductive adhesive composition, wherein the catalyst has a core-shell structure with a shell encapsulating a core, the core of the catalyst comprises an amine-based compound, and the shell of the catalyst is prepared by reacting at least two of an epoxy resin, an amine-based compound, and a polyisocyanate. Also provided are a preparation method and use of the thermally conductive adhesive composition.

Inventors:
YAO WEI (CN)
WU QILI (CN)
HUANG CHENYU (CN)
YU YUANYUAN (CN)
TI YANG (CN)
Application Number:
PCT/CN2021/120104
Publication Date:
March 30, 2023
Filing Date:
September 24, 2021
Export Citation:
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Assignee:
HENKEL AG & CO KGAA (DE)
ABLESTIK SHANGHAI LTD (CN)
International Classes:
C09J9/00; C09J163/00
Foreign References:
JP2007091900A2007-04-12
JP2016130287A2016-07-21
JP2011086669A2011-04-28
CN104927733A2015-09-23
CN103497717A2014-01-08
JP2013072011A2013-04-22
JP2010053353A2010-03-11
CN101611066A2009-12-23
JP2010132840A2010-06-17
CN103194164A2013-07-10
CN110023444A2019-07-16
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LIMITED (CN)
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