Title:
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/191045
Kind Code:
A1
Abstract:
A thermally conductive adhesive composition comprising: an adhesive component containing high polymers and low polymers; and thermally conductive particles. The gel fraction measured in the adhesive component is 28%-59% by mass and the thermal conductivity thereof is at least 0.3 W/m·K.
Inventors:
FURUTA KENJI (JP)
TERADA YOSHIO (JP)
INOKUCHI SHINJI (JP)
TERADA YOSHIO (JP)
INOKUCHI SHINJI (JP)
Application Number:
PCT/JP2013/066177
Publication Date:
December 27, 2013
Filing Date:
June 12, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/22; C09J7/30; C09J11/04
Foreign References:
JP2006111644A | 2006-04-27 | |||
JP2011132474A | 2011-07-07 | |||
JP2000109779A | 2000-04-18 | |||
JP2012041456A | 2012-03-01 | |||
JP2002241709A | 2002-08-28 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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