Title:
THERMALLY CONDUCTIVE COMPOSITE FILLER, HEAT-DISSIPATING RESIN COMPOSITION CONTAINING SAME, AND HEAT-DISSIPATING GREASE AND HEAT-DISSIPATING MEMBER COMPRISING SAID HEAT-DISSIPATING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/194131
Kind Code:
A1
Abstract:
[Problem] To improve a thermally conductive filler. [Solution] A thermally conductive composite filler containing a first thermally conductive filler, a second thermally conductive filler, and a polyvinylacetal resin that serves as a binder. Typically, the first thermally conductive filler is aluminum nitride and the second thermally conductive filler is boron nitride. A resin composition in which the above thermally conductive composite filler is used. A heat-dissipating member in which the above resin composition is used.
Inventors:
FUJIWARA TAKESHI (JP)
KOGA SHIN (JP)
UJIIYE KENTO (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
KOGA SHIN (JP)
UJIIYE KENTO (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
Application Number:
PCT/JP2019/014481
Publication Date:
October 10, 2019
Filing Date:
April 01, 2019
Export Citation:
Assignee:
JNC CORP (JP)
OSAKA RES INST IND SCIENCE & TECH (JP)
OSAKA RES INST IND SCIENCE & TECH (JP)
International Classes:
C08L29/14; C08K3/01; H01L23/373
Domestic Patent References:
| WO2013145961A1 | 2013-10-03 |
Foreign References:
| KR20110119256A | 2011-11-02 | |||
| JP2013155366A | 2013-08-15 |
Attorney, Agent or Firm:
IZAWA&IZAWA INTERNATIONAL PPC et al. (JP)
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