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Title:
THERMALLY CONDUCTIVE COMPOSITE MATERIAL USING HEXAGONAL BORON NITRIDE
Document Type and Number:
WIPO Patent Application WO/2023/182690
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive composite material using hexagonal boron nitride. The composite material may comprise: a polymer matrix, which is formed in the axial direction and has one side perpendicular to the axial direction; a first h-BN added to the polymer matrix; and a second h-BN, which is added to the polymer matrix and is smaller than the first h-BN.

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Inventors:
CHOA YONG-HO (KR)
MUN HYUNG JIN (KR)
PARK JI YOUNG (KR)
LIM MIN SEOB (KR)
CHO HONG-BAEK (KR)
Application Number:
PCT/KR2023/002784
Publication Date:
September 28, 2023
Filing Date:
February 28, 2023
Export Citation:
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Assignee:
IUCF HYU ERICA CAMPUS (KR)
International Classes:
C08K3/38; C01B21/064; C08L83/04; C08L101/00
Foreign References:
CN109280332A2019-01-29
KR20140121161A2014-10-15
KR20020002257A2002-01-09
KR20140141456A2014-12-10
KR20200069912A2020-06-17
Attorney, Agent or Firm:
KIM, Joon Seok et al. (KR)
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