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Title:
THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2019/189794
Kind Code:
A1
Abstract:
The present invention provides thermally conductive composite particles, each of which is provided with a core part that contains inorganic particles and a shell part that contains nitride particles and covers the core part. The thermally conductive composite particles have been sintered.

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Inventors:
SUZUKI KOHEI (JP)
MARUICHI TOSHIAKI (JP)
Application Number:
PCT/JP2019/014078
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H01L23/36; C01F7/02; C04B35/626; C04B35/628; C08K3/28; C08L101/00; H01B3/30; H01L23/12; H01L23/373; H05K1/05
Foreign References:
JP2015214639A2015-12-03
JP2016017014A2016-02-01
JP2016192474A2016-11-10
JP2017095555A2017-06-01
JP2011219309A2011-11-04
JP2001031887A2001-02-06
JP2008195766A2008-08-28
JP2009164402A2009-07-23
JPH07267614A1995-10-17
JP2011035221A2011-02-17
JP2005344171A2005-12-15
JP2016192474A2016-11-10
JPS5115029B21976-05-13
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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