Title:
THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED
Document Type and Number:
WIPO Patent Application WO/2020/133374
Kind Code:
A1
Abstract:
A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.
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Inventors:
HU XIAOLIAN (CN)
ZHANG JIGUANG (CN)
ZHENG YAN (CN)
CHEN HONGYU (CN)
CHEN CHEN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
ZHANG JIGUANG (CN)
ZHENG YAN (CN)
CHEN HONGYU (CN)
CHEN CHEN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
Application Number:
PCT/CN2018/125408
Publication Date:
July 02, 2020
Filing Date:
December 29, 2018
Export Citation:
Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
DOW SILICONES CORP (US)
HU XIAOLIAN (CN)
ZHANG JIGUANG (CN)
ZHENG YAN (CN)
CHEN HONGYU (CN)
CHEN CHEN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
DOW SILICONES CORP (US)
HU XIAOLIAN (CN)
ZHANG JIGUANG (CN)
ZHENG YAN (CN)
CHEN HONGYU (CN)
CHEN CHEN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
International Classes:
C08L83/07; C08K13/02
Foreign References:
| US20130248163A1 | 2013-09-26 | |||
| US20110311767A1 | 2011-12-22 | |||
| CN103045158A | 2013-04-17 | |||
| CN105531321A | 2016-04-27 | |||
| CN105555853A | 2016-05-04 | |||
| CN1205721A | 1999-01-20 | |||
| CN103946314A | 2014-07-23 |
Other References:
See also references of EP 3902873A4
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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