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Patent Searching and Data


Title:
THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/150944
Kind Code:
A1
Abstract:
The present invention provides: a thermally conductive composition which is not decreased in flexibility and exhibits good bendability, excellent handling properties and excellent thermal conductivity even if cured into a thermally conductive molded body; and a molded body of this thermally conductive composition. A thermally conductive composition which contains a thermally conductive filler in a polymer matrix, and which is characterized in that: a methyl phenyl silicone is contained therein; the thermally conductive filler has an average particle diameter of 10-100 μm; the content ratio of the thermally conductive filler in the thermally conductive composition is 70-90% by volume; and 30-80% by volume of the thermally conductive filler has a particle diameter of 40 μm or more. A thermally conductive molded body is a cured product of this thermally conductive composition.

Inventors:
UMETANI HIROSHI (JP)
Application Number:
PCT/JP2019/000994
Publication Date:
August 08, 2019
Filing Date:
January 16, 2019
Export Citation:
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Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L101/00; C08J5/18; C08K3/01; C08K3/08; C08K3/14; C08K3/22; C08K3/28; C08L83/04; H01L23/36
Domestic Patent References:
WO2018088416A12018-05-17
Foreign References:
JP2012007057A2012-01-12
JP2014193598A2014-10-09
JP2005194479A2005-07-21
JP2007277406A2007-10-25
JP2007150349A2007-06-14
JP2016113540A2016-06-23
Other References:
See also references of EP 3747953A4
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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