Title:
THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/037862
Kind Code:
A1
Abstract:
Provided is a thermally conductive composition comprising: a curable component; a curing agent for curing the curable component; and a metal filler. The metal filler includes thermally conductive particles and low-melting-point metal particles, the volume average particle size of the thermally conductive particles is larger than the volume average particle size of the low-melting-point metal particles, and the melting point of the low-melting-point metal particles is lower than the thermal curing process temperature of the thermally conductive composition.
Inventors:
ZHAO YIJING (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
NISHIO TAKESHI (JP)
INOUE MAKOTO (JP)
KAWAKAMI RYOKO (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
NISHIO TAKESHI (JP)
INOUE MAKOTO (JP)
KAWAKAMI RYOKO (JP)
Application Number:
PCT/JP2022/031612
Publication Date:
March 16, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; C08K3/08; C08L63/00; C08L71/02; C08L101/00; C09K5/14; H01L23/373
Foreign References:
| JP2007173317A | 2007-07-05 | |||
| JP2004335872A | 2004-11-25 | |||
| JP2004039829A | 2004-02-05 | |||
| JP5796242B2 | 2015-10-21 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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