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Title:
THERMALLY CONDUCTIVE COMPOSITIONS AND METHODS OF MAKING THEREOF
Document Type and Number:
WIPO Patent Application WO2005096320
Kind Code:
A3
Abstract:
A composition comprising at least one liquid metal having a melting point less than 35°C; at least one electrically insulating solid filler comprising thermally conducting materials; at least one resin is provided. The composition is both thermally conducting and electrically insulating and has utility in the preparation of electronic devices comprising heat generating and heat dissipating structures. In one instance a composition is provided which comprises a liquid metal selected from the group consisting of gallium, gallium alloys, and mixtures thereof, a boron nitride particulate filler, and a silicone resin, wherein said liquid metal and particulate filler are present in a volume ratio of about 1:0.4 to about 1: 10. A method of making and using such a composition is also provided.

Inventors:
ZHONG HONG (US)
GOWDA ARUN VIRUPAKSHA (US)
ESLER DAVID RICHARD (US)
PAISNER SARA NAOMI (US)
Application Number:
PCT/US2005/010600
Publication Date:
April 06, 2006
Filing Date:
March 29, 2005
Export Citation:
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Assignee:
GEN ELECTRIC (US)
ZHONG HONG (US)
GOWDA ARUN VIRUPAKSHA (US)
ESLER DAVID RICHARD (US)
PAISNER SARA NAOMI (US)
International Classes:
C08K3/08; H01B3/00; H01L23/373; H01L23/42; (IPC1-7): H01B3/00; C08K3/08
Foreign References:
US20030187116A12003-10-02
US20030157342A12003-08-21
US20010038093A12001-11-08
US20030077478A12003-04-24
EP1414063A22004-04-28
Other References:
DATABASE WPI Section Ch Week 200331, Derwent World Patents Index; Class A85, AN 2003-333563, XP002350340
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