THERMALLY CONDUCTIVE FILLER AND THERMALLY CONDUCTIVE RESIN COMPOSITION CONTAINING SAME

Title:

THERMALLY CONDUCTIVE FILLER AND THERMALLY CONDUCTIVE RESIN COMPOSITION CONTAINING SAME

Document Type and Number:

WIPO Patent Application WO/2015/041110

Kind Code:

A1

Abstract:

　A thermally conductive resin filler including a sintered body containing at least magnesium oxide, calcium oxide, and silicon oxide, the thermally conductive filler being characterized in that the molar ratio of calcium oxide (CaO) to silicon oxide (SiO2) shown by MCa/MSi is within a range from 0.1 to less than 2.0 when the number of moles of elemental calcium included in the entire composition of the sintered body in terms of calcium oxide (CaO) is MCa and the number of moles of elemental silicon included in the entire composition of the sintered body in terms of silicon oxide (SiO2) is MSi.

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Inventors:

NISHIDA NAOTO (JP)
YAMAGUCHI SEIJI (JP)
YOSHIDA AKIRA (JP)
SHIMMATSU SATOSHI (JP)

Application Number:

PCT/JP2014/073880

Publication Date:

March 26, 2015

Filing Date:

September 10, 2014

Export Citation:

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Assignee:

UBE MAT IND LTD (JP)

International Classes:

C08K3/34; C01F5/02; C04B35/04; C08L101/00

Domestic Patent References:

WO2014119462A1

2014-08-07

Foreign References:

JP2010173913A	2010-08-12
JP2004027177A	2004-01-29
JP2014136654A	2014-07-28

Attorney, Agent or Firm:

KISARAGI ASSOCIATES (JP)
きさらぎ international patent business corporation (JP)

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