Title:
THERMALLY CONDUCTIVE GREASE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070068
Kind Code:
A1
Abstract:
The present invention pertains to a thermally conductive grease composition containing a matrix resin and a thermally conductive filler. The matrix resin contains: liquid dimethylpolysiloxane (A) having a kinematic viscosity of 100-10,000 mm2/s at 40ºC; and an ethylene-propylene copolymer (B) having a kinematic viscosity of 1-10,000 mm2/s at 40ºC. When the total amount of the liquid dimethylpolysiloxane (A) and the ethylene-propylene copolymer (B) is 100 parts by mass, the matrix resin contains 50-97 parts by mass of the liquid dimethylpolysiloxane (A) and 3-50 parts by mass of the ethylene-propylene copolymer (B). The thermally conductive grease composition according to the present disclosure contains 400-2,500 parts by mass of the thermally conductive filler with respect to 100 parts by mass of the total amount of the liquid dimethylpolysiloxane (A) and the ethylene-propylene copolymer (B).
Inventors:
KATAISHI TAKUMI
Application Number:
PCT/JP2023/021843
Publication Date:
April 04, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L83/04; C08K3/22; C08K5/5415; C08L23/16; C09K5/14
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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