Title:
THERMALLY CONDUCTIVE INSULATION COMPOSITION AND HEAT SINK MADE THEREFROM
Document Type and Number:
WIPO Patent Application WO/2018/216836
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive insulation composition which can be injected at a low temperature, can prevent thermal damage of a semiconductor sensor even when the composition is integrally injected with a semiconductor sensor insert, and can be produced into an injection-molded product having an excellent mechanical property, and a heat sink made therefrom.
Inventors:
YOUN HYUNG GWAN (KR)
LEE JAE SIK (KR)
KIM SUNG JIN (KR)
LEE JAE SIK (KR)
KIM SUNG JIN (KR)
Application Number:
PCT/KR2017/005535
Publication Date:
November 29, 2018
Filing Date:
May 26, 2017
Export Citation:
Assignee:
HI CNT CO LTD (KR)
International Classes:
C08L67/04; B29B7/88; B29B9/00; B29B11/06; B29C45/14; C08K3/04; C08K3/34; C08K9/08; C08L23/12; H01L23/373
Foreign References:
| JP2010100759A | 2010-05-06 | |||
| KR101116724B1 | 2012-03-13 | |||
| KR101211134B1 | 2012-12-11 | |||
| CN103122140A | 2013-05-29 | |||
| US20160276056A1 | 2016-09-22 | |||
| KR20150136292A | 2015-12-07 | |||
| KR101266264B1 | 2013-06-07 |
Attorney, Agent or Firm:
DOOHO IP LAW FIRM (KR)
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