Title:
THERMALLY CONDUCTIVE, MOISTURE-CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/042638
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive, moisture-curable composition capable of efficiently conducting heat for components that involve heat generation. The present invention relates to a thermally conductive, moisture curable resin composition comprising (A) an organic polymer containing two or more cross-linkable hydrolyzable silyl groups, (B) a thermally conductive filler, and (C) a polyether compound having a cross-linkable hydrolyzable silyl group at only one terminal.
Inventors:
MATSUKI TAKASHI
ADACHI MAMORU
MAEDA YASUO
FUJISAWA TSUNETOSHI
MOTOKI SHIGEKAZU
IDE MIYOKA
ADACHI MAMORU
MAEDA YASUO
FUJISAWA TSUNETOSHI
MOTOKI SHIGEKAZU
IDE MIYOKA
Application Number:
PCT/JP2012/073736
Publication Date:
March 28, 2013
Filing Date:
September 14, 2012
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
MATSUKI TAKASHI
ADACHI MAMORU
MAEDA YASUO
FUJISAWA TSUNETOSHI
MOTOKI SHIGEKAZU
IDE MIYOKA
MATSUKI TAKASHI
ADACHI MAMORU
MAEDA YASUO
FUJISAWA TSUNETOSHI
MOTOKI SHIGEKAZU
IDE MIYOKA
International Classes:
C08L101/10; C08G81/00; C08K3/00; C08L71/02; H01L23/36; H01L23/373
Domestic Patent References:
| WO2005073276A1 | 2005-08-11 | |||
| WO2011132629A1 | 2011-10-27 | |||
| WO2011125636A1 | 2011-10-13 |
Foreign References:
| JP2004224985A | 2004-08-12 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims:
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