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Title:
THERMALLY CONDUCTIVE MOISTURE-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/159753
Kind Code:
A1
Abstract:
[Problem] To provide a thermally conductive moisture-curable resin composition which exhibits excellent thermal conductivity and peelability after curing. [Solution] This thermally conductive moisture-curable resin composition contains components (A)-(C): component (A) of an organic polymer containing two or more hydrolyzable silyl groups; component (B) of a thermally conductive filler; and component (C) of a silicone compound having a polar group and/or a polar chain at the terminal or side chain thereof.

Inventors:
WATANABE, Kentaro (4-3-3 Minamiosawa, Hachioji-sh, Tokyo 98, 〒1920398, JP)
Application Number:
JP2019/004007
Publication Date:
August 22, 2019
Filing Date:
February 05, 2019
Export Citation:
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Assignee:
THREEBOND CO., LTD. (4-3-3 Minamiosawa, Hachioji-shi Tokyo, 98, 〒1920398, JP)
International Classes:
C08L101/10; C08K3/01; C08K5/54; C08L83/04; C08L83/12; C09D5/00; C09D7/61; C09D7/65; C09D201/10
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
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