Title:
THERMALLY CONDUCTIVE MOUNTING ARRANGEMENT FOR SECURING AN INTEGRATED CIRCUIT PACKAGE TO A HEAT SINK
Document Type and Number:
WIPO Patent Application WO1999062117
Kind Code:
A9
Abstract:
An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficent force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.
Inventors:
AHL BENGT
LEIGHTON LARRY C
MOLLER THOMAS W
LEIGHTON LARRY C
MOLLER THOMAS W
Application Number:
PCT/US1999/010503
Publication Date:
June 15, 2000
Filing Date:
May 12, 1999
Export Citation:
Assignee:
ERICSSON INC (US)
International Classes:
H01L23/40; H01L23/433; H05K7/20; (IPC1-7): H01L23/40; H05K7/20
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