Title:
THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDING
Document Type and Number:
WIPO Patent Application WO/2015/136806
Kind Code:
A1
Abstract:
As a polymer composition that is highly filled with aluminum nitride particles and nevertheless can yield a thermally conductive molding unlikely to contain bubbles therein, the present invention provides a thermally conductive polymer composition comprising aluminum nitride particles having a specific particle size distribution, and a polymer.
Inventors:
HATAKEYAMA YOSHIHARU (JP)
FUJIKAWA KENICHI (JP)
YAMAGUCHI MIHO (JP)
OOHASHI AKIHIRO (JP)
YAMAGISHI YUJI (JP)
FUJIKAWA KENICHI (JP)
YAMAGUCHI MIHO (JP)
OOHASHI AKIHIRO (JP)
YAMAGISHI YUJI (JP)
Application Number:
PCT/JP2014/083293
Publication Date:
September 17, 2015
Filing Date:
December 16, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
NITTO SHINKO CORP (JP)
NITTO SHINKO CORP (JP)
International Classes:
C08K3/28; C08L101/00
Domestic Patent References:
| WO2013065758A1 | 2013-05-10 | |||
| WO2013145961A1 | 2013-10-03 |
Foreign References:
| JP2012211225A | 2012-11-01 | |||
| JP2011256295A | 2011-12-22 | |||
| JP2013234313A | 2013-11-21 | |||
| JP2015013927A | 2015-01-22 |
Other References:
See also references of EP 3118261A4
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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