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Title:
THERMALLY CONDUCTIVE POLYORGANOSILOXANE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/139506
Kind Code:
A1
Abstract:
The present invention pertains to a thermally conductive polysiloxane composition that provides a cured material having excellent tack properties and an excellent flexibility. This thermally conductive polysiloxane composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a straight-chain siloxane structure, (C) a polyorganosiloxane having at least two silicon atom-bonded alkenyl groups in each molecule, (D1) a straight-chain polyorganosiloxane represented by general formula (4), (D2) a polyorganohydrogensiloxane having in each molecule at least three units represented by general formula (5), and (E) a platinum catalyst.

Inventors:
HIRAKAWA DAIGO (JP)
TAKANASHI MASANORI (JP)
SAKAMOTO ATSUSHI (JP)
Application Number:
PCT/JP2018/002191
Publication Date:
August 02, 2018
Filing Date:
January 25, 2018
Export Citation:
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Assignee:
MOMENTIVE PERFORMANCE MAT JP (JP)
International Classes:
C08L83/07; C08K3/00; C08L83/04; C08L83/05
Domestic Patent References:
WO2005030874A12005-04-07
WO2005030874A12005-04-07
Foreign References:
JP2015074751A2015-04-20
JP2015214703A2015-12-03
JP2009091561A2009-04-30
JP2009203373A2009-09-10
JP2002003831A2002-01-09
JP2002327116A2002-11-15
Other References:
See also references of EP 3575365A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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