Title:
THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/221637
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive polysiloxane composition containing: (A) a thermally conductive filler; (B) a siloxane compound of a specific structure; (C) an alkoxysilane compound of a specific structure; (D) a polyorganosiloxane having one or more aliphatic unsaturated groups per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.
Inventors:
TAKENAKA KENJI (JP)
SAKAMOTO ATSUSHI (JP)
SAKAMOTO ATSUSHI (JP)
Application Number:
PCT/JP2018/020905
Publication Date:
December 06, 2018
Filing Date:
May 31, 2018
Export Citation:
Assignee:
MOMENTIVE PERFORMANCE MAT JP (JP)
International Classes:
C08K3/36; C08L83/06; C08K9/06; C08L83/05; C08L83/07
Domestic Patent References:
| WO2005030874A1 | 2005-04-07 |
Foreign References:
| JP2015071662A | 2015-04-16 | |||
| JP2008150439A | 2008-07-03 | |||
| JP2008266449A | 2008-11-06 | |||
| JP2005162975A | 2005-06-23 | |||
| JP2008280395A | 2008-11-20 | |||
| JP2006143978A | 2006-06-08 | |||
| JP2002003831A | 2002-01-09 | |||
| JP2008156578A | 2008-07-10 |
Other References:
See also references of EP 3632987A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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