Title:
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE AND ADHESIVE SHEET CONTAINING THE SAME
Document Type and Number:
WIPO Patent Application WO/1998/023700
Kind Code:
A1
Abstract:
An adhesive sheet (2) is interposed between an electronic part (1) and a heat-radiating member (3). The sheet (2) comprises a thermally conductive substrate (21) and, disposed respectively on both sides thereof, layers (22 and 23) of a thermally conductive pressure-sensitive adhesive comprising: (a) 100 parts by weight of a copolymer of a monomer mixture comprising 100 parts by weight of main monomers consisting mainly of alkyl (meth)acrylates in which the alkyls each has 2 to 14 carbon atoms on average and 1 to 30 parts by weight of a polar monomer giving a homopolymer having a glass transition point of 0 �C or lower; and (b) 10 to 300 parts by weight of a thermally conductive filler. Thus, the part (1) is bonded to the member (3) with the layers (22 and 23) while attaining satisfactory thermal conduction therebetween.
More Like This:
Inventors:
MUTA SHIGEKI (JP)
OHURA MASAHIRO (JP)
YOSHIKAWA TAKAO (JP)
OHURA MASAHIRO (JP)
YOSHIKAWA TAKAO (JP)
Application Number:
PCT/JP1997/004217
Publication Date:
June 04, 1998
Filing Date:
November 19, 1997
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
MUTA SHIGEKI (JP)
OHURA MASAHIRO (JP)
YOSHIKAWA TAKAO (JP)
MUTA SHIGEKI (JP)
OHURA MASAHIRO (JP)
YOSHIKAWA TAKAO (JP)
International Classes:
C09J7/22; C09J7/38; C09J9/00; C09J133/06; C08L33/06; (IPC1-7): C09J133/06; C09J7/02; C09J9/00
Foreign References:
| JPH0688061A | 1994-03-29 | |||
| JPS6433175A | 1989-02-03 | |||
| JPS553488A | 1980-01-11 | |||
| JPH04114075A | 1992-04-15 |
Other References:
See also references of EP 0942059A4
Attorney, Agent or Firm:
Hagino, Taira (Ark Mori Building 28th floor, 12-32, Akasaka 1-chom, Minato-ku Tokyo 107, JP)
Download PDF: