Title:
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE, ADHESIVE SHEET CONTAINING THE SAME, AND METHOD FOR FIXING ELECTRONIC PART TO HEAT-RADIATING MEMBER WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/1998/024860
Kind Code:
A1
Abstract:
A thermally conductive pressure-sensitive adhesive which is excellent in thermal conductivity and adhesive properties, has a high adhesive strength especially at high temperatures (high holding power under high-temperature shear), undergoes no abrupt viscosity increase during or after adhesive production, and has excellent stability. The adhesive comprises: (a) 100 parts by weight of a copolymer of a monomer mixture comprising 70 to 99 wt.% monomers consisting mainly of alkyl (meth)acrylates in which the alkyls each has 2 to 14 carbon atoms on the average and 30 to 1 wt.% copolymerizable monomer having an acidic or basic polar group in the molecule; and (b) 10 to 300 parts by weight of a thermally conductive filler having the same polar groups as the copolymerizable monomer and a purity of 95 wt.% or higher. The adhesive sheet comprises a substrate and, formed thereon, a layer of the thermally conductive pressure-sensitive adhesive. The method for fixing an electronic part to a heat-radiating member comprises the use of the adhesive or the adhesive sheet.
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Inventors:
OHURA MASAHIRO (JP)
MUTA SHIGEKI (JP)
YOSHIKAWA TAKAO (JP)
MUTA SHIGEKI (JP)
YOSHIKAWA TAKAO (JP)
Application Number:
PCT/JP1997/004320
Publication Date:
June 11, 1998
Filing Date:
November 26, 1997
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
OHURA MASAHIRO (JP)
MUTA SHIGEKI (JP)
YOSHIKAWA TAKAO (JP)
OHURA MASAHIRO (JP)
MUTA SHIGEKI (JP)
YOSHIKAWA TAKAO (JP)
International Classes:
C09J7/22; C09J7/38; C09J9/00; C09J133/06; H01L21/58; H05K3/32; (IPC1-7): C09J133/06; C09J7/02; C09J9/00
Foreign References:
JPH0688061A | 1994-03-29 | |||
JPS6433175A | 1989-02-03 | |||
JPS62503174A | 1987-12-17 | |||
JPH04114075A | 1992-04-15 |
Other References:
See also references of EP 0942060A4
Attorney, Agent or Firm:
Hagino, Taira (ARK Mori Building 28th floor, 12-32, Akasaka 1-chom, Minato-ku Tokyo 107, JP)
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