Title:
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2007/116686
Kind Code:
A1
Abstract:
Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composition (S) mainly containing at least one material selected from rubbers, elastomers and resins. Preferably, the composition (S) contains a (meth)acrylate polymer (A1) as a main component; and more preferably, it further contains a (meth)acrylate monomer (A2m). The thermally conductive pressure-sensitive adhesive composition (F) has an excellent balance among flame retardance, hardness and thermal conductivity, and is suitably used as a thermally conductive pressure-sensitive adhesive sheet-like molded body (G) by being molded into a sheet-like shape.
Inventors:
SAKAYA MITSURO (JP)
KUMAMOTO TAKURO (JP)
KUMAMOTO TAKURO (JP)
Application Number:
PCT/JP2007/056225
Publication Date:
October 18, 2007
Filing Date:
March 26, 2007
Export Citation:
Assignee:
ZEON CORP (JP)
SAKAYA MITSURO (JP)
KUMAMOTO TAKURO (JP)
SAKAYA MITSURO (JP)
KUMAMOTO TAKURO (JP)
International Classes:
C09J201/00; C09J7/10; C09J11/04
Foreign References:
| JP2000038785A | 2000-02-08 | |||
| JP2002322449A | 2002-11-08 | |||
| JPS63156091A | 1988-06-29 | |||
| JPH1171469A | 1999-03-16 |
Attorney, Agent or Firm:
UCHIDA, Yukio et al. (Sunny Port Shiba 10055-10, Shiba 2-chom, Minato-ku Tokyo 14, JP)
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