Title:
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-FORM MOLDED BODY, MANUFACTURING METHOD OF THESE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/061830
Kind Code:
A1
Abstract:
This mixed composition contains 100 parts by mass of a (meth)acrylate resin composition (A) containing (meth)acrylate acid ester polymers (A1) and (meth)acrylate acid ester monomers (α1), 90-1200 parts by mass of a thermally conductive filler (B), 0.2-8 parts by mass of polyfunctional monomers (D) having multiple polymerizable unsaturated bonds, and 0.3-5.0 parts by mass of a polyfunctional epoxy compound (E) having 2 to 10000 functional groups and a viscosity at 25°C of 600mPa*s or less. This composition is characterized by performing a polymerization reaction between the (meth)acrylate acid ester monomers (α1) and the polyfunctional monomers (D), and a crosslinking reaction of the (meth)acrylate acid ester polymers (A1) and/or polymers containing structural units derived from the (meth)acrylate acid ester monomers (α1).
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Inventors:
KUMAMOTO TAKUROU (JP)
KITAGAWA HIROMI (JP)
KITAGAWA HIROMI (JP)
Application Number:
PCT/JP2012/076727
Publication Date:
May 02, 2013
Filing Date:
October 16, 2012
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C09J133/04; C09J4/02; C09J7/10; C09J11/02; C09J163/00
Domestic Patent References:
| WO2011102170A1 | 2011-08-25 | |||
| WO2010073649A1 | 2010-07-01 | |||
| WO2008093440A1 | 2008-08-07 | |||
| WO2012132656A1 | 2012-10-04 |
Foreign References:
| JPH10292158A | 1998-11-04 | |||
| JPH11349905A | 1999-12-21 |
Attorney, Agent or Firm:
YAMAMOTO, Noriaki et al. (JP)
Yamamoto 典輝 (JP)
Yamamoto 典輝 (JP)
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Claims:
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